Silicon molding techniques for integrated power MEMS inductors

Sensors and Actuators, A: Physical

Volumn 166, Issue 1, 2011, Pages 157-163

  Wang, M ^a   Li, J ^a   Ngo, K ^b   Xie, H ^a  

^a UNIVERSITY OF FLORIDA   (United States)

^b State University   (United States)

Author keywords

Integrated inductor; MEMS; Power converter; Silicon substrate molding

Indexed keywords

CORE LOSS; DC RESISTANCE; ELECTRICAL ISOLATION; ELECTROPLATED METALS; EMBEDDED METALS; INTEGRATED INDUCTORS; INTEGRATED POWER; LOW FREQUENCY; LOW POWER; MEMS INDUCTOR; MOLDING TECHNIQUES; MONOLITHIC INTEGRATION; ON CHIPS; ONCHIP INDUCTORS; PORTABLE ELECTRONICS; SATURATION CURRENT; SILICON SUBSTRATE MOLDING; SILICON SUBSTRATES; SILICON TRENCH; TRANSIENT PERFORMANCE;

DC POWER TRANSMISSION; DC-DC CONVERTERS; INDUCTANCE; LITHOGRAPHY; MEMS; METAL MOLDING; MONOLITHIC INTEGRATED CIRCUITS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES;

ELECTRIC INDUCTORS;

EID: 79951653428     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2010.12.012     Document Type: Article

References (25)

1. R.J. Huljak, V.J. Thottuvelil, A.J. Marsh, and B.A. Miller Where are power supplies headed? Applied Power Electronics Conference and Exposition, 2000 (APEC 2000). Fifteenth Annual IEEE 2000 7 10
2. H.J. Bergveld, R. Karadi, and K. Nowak An inductive down converter system-in-package for integrated power management in battery-powered applications Power Electronics Specialists Conference, 2008 (PESC 2008). IEEE 2008 3335 3341
3. P. Hazucha, G. Schrom, H. Jaehong, B.A. Bloechel, P. Hack, G.E. Dermer, S. Narendra, D. Gardner, T. Karnik, V. De, and S. Borkar A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package IEEE Journal of Solid-State Circuits 40 2005 838 845
4. J. Wibben, and R. Harjani A high-efficiency DC-DC converter using 2 nH integrated inductors IEEE Journal of Solid-State Circuits 43 2008 844 854
5. D. Morrison Regulators embed inductors to save space and ease use Power Electronics Technology 2007 46 47
6. T. O'Donnell, N. Wang, R. Meere, F. Rhen, S. Roy, D. O'Sullivan, and C. O'Mathuna Microfabricated inductors for 20 MHz Dc-Dc converters Applied Power Electronics Conference and Exposition, 2008 (APEC 2008). Twenty-Third Annual IEEE 2008 689 693
7. S.C.O. Mathuna, T. O'Donnell, W. Ningning, and K. Rinne Magnetics on silicon: an enabling technology for power supply on chip IEEE Transactions on Power Electronics 20 2005 585 592 (Pubitemid 40717951)
8. T. Liakopoulos, R. Filas, M. Wilkowski, and A. Lotfi Power supply chip includes thin film power inductor Switching Power Magazine 2004 20 23
9. J.W. Park, and M.G. Allen Ultralow-profile micromachined power inductors with highly laminated Ni/Fe cores: application to low-megahertz DC-DC converters IEEE Transactions on Magnetics 39 2003 3184 3186
10. C.H. Ahn, and M.G. Allen Micromachined planar inductors on silicon wafers for MEMS applications IEEE Transactions on Industrial Electronics 45 1998 866 876 (Pubitemid 128740309)
11. T. Sato, K. Yamazawa, H. Tomita, T. Inoue, and T. Mizoguchi Planar power inductor using FeCoBn magnetic film with high saturation magnetization and high electrical resistivity The Fourth International Power Electronics Conferences IPEC Tokyo, Japan 2000 303 308
12. Y. Katayama, S. Sugahara, H. Nakazawa, and M. Edo High-power-density MHz-switching monolithic DC-DC converter with thin-film inductor Power Electronics Specialists Conference, 2000 (PESC 00. 2000) 31st Annual IEEE, vol. 3 2000 1485 1490 (Pubitemid 32190240)
13. K.H. Kim, J. Kim, H.J. Kim, S.H. Han, and H.J. Kim A megahertz switching DC/DC converter using FeBN thin film inductor IEEE Transactions on Magnetics 38 2002 3162 3164 (Pubitemid 35444722)
14. S. Prabhakaran, Y. Sun, P. Dhagat, W.D. Li, and C.R. Sullivan Microfabricated V-groove power inductors for high-current low-voltage fast-transient DC-DC converters Power Electronics Specialists Conference, 2005 (PESC 05). IEEE 36th 2005 1513 1519 (Pubitemid 46379376)
15. M. Saidani, and M.A.M. Gijs Cubic millimeter power inductor fabricated in batch-type wafer technology Journal of Microelectromechanical Systems 12 2003 172 178
16. N. Nguyen, K. Ng, E. Boellaard, N. Pham, G. Craciun, P. Sarro, and J. Burghartz Through-wafer copper electroplating for RF silicon technology Solid-State Device Research Conference, 2002. Proceeding of the 32nd European 2002 255 258
17. W. Zheyao, W. Lianwei, N.T. Nguyen, W.A.H. Wien, H. Schellevis, P.M. Sarro, and J.N. Burghartz Silicon micromachining of high aspect ratio, high-density through-wafer electrical interconnects for 3-D multichip packaging IEEE Transactions on Advanced Packaging 29 2006 615 622 (Pubitemid 44263704)
18. D.P. Arnold, I. Zana, F. Cros, and M.G. Allen Vertically laminated magnetic cores by electroplating Ni-Fe into micromachined Si IEEE Transactions on Magnetics 40 2004 3060 3062
19. M. Wang, K.D.T. Ngo, I. Batarseh, and H. Xie Integrated power inductor with silicon substrate molding Asia-Pacific Conference on Transducers and Micro-nano Technolog, APCOT Singapore 2006
20. M. Wang, I. Batarseh, K.D.T. Ngo, and H. Xie Design and fabrication of integrated power inductor based on silicon molding technology Power Electronics Specialists Conference, 2007 (PESC 2007). IEEE 2007 1612 1618
21. F. Walther, P. Davydovskaya, S. Zürcher, M. Kaiser, H. Herberg, A.M. Gigler, and R.W. Stark Stability of the hydrophilic behavior of oxygen plasma activated SU-8 Journal of Micromechanics and Microengineering 17 2007 524 531 (Pubitemid 46778465)
22. K.C. Yung, T.M. Yue, K.C. Chan, and K.F. Yeung The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture IEEE Transactions on Electronics Packaging Manufacturing 26 2003 106 109
23. M. Wang, J. Li, K.D.T. Ngo, and H. Xie A novel integrated power inductor in silicon substrate for ultra-compact power supplies Applied Power Electronics Conference and Exposition (APEC), 2010, Twenty-Fifth Annual IEEE 2010 2036 2041
24. S. Prabhakaran, C.R. Sullivan, and K. Venkatachalam Measured electrical performance of V-groove inductors for microprocessor power delivery IEEE Transactions on Magnetics 39 2003 3190 3192
25. P. Nakmahachalasint, and K.D.T. Ngo High-temperature, high-frequency characterization system for power ferrites IEEE Transactions on Instrumentation and Measurement 52 2003 804 808