Low-frequency acoustic phonon temperature distribution in electrically biased graphene

Nano Letters

Volumn 11, Issue 1, 2011, Pages 85-90

  Jo, Insun ^a   Hsu, I Kai ^b   Lee, Yong J ^c,d   Sadeghi, Mir Mohammad ^c   Kim, Seyoung ^c   Cronin, Stephen ^b   Tutuc, Emanuel ^c   Banerjee, Sanjay K ^c   Yao, Zhen ^a   Shi, Li ^c  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b University of Southern California ^*  (United States)

^c The University of Texas at Austin   (United States)

^d Kyungpook National University   (South Korea)

Author keywords

Acoustic phonons; Electrical heating; Graphene; Raman spectroscopy; Scanning thermal microscopy

Indexed keywords

ACOUSTIC PHONONS; ANHARMONIC SCATTERING; ELECTRICAL HEATING; GATE VOLTAGES; HOT SPOT; INFRARED EMISSIONS; LOW FREQUENCY; PEAK POSITION; SCANNING THERMAL MICROSCOPY; SPATIAL RESOLUTION;

CARRIER CONCENTRATION; ELECTRIC HEATING; ELECTROMAGNETIC WAVE EMISSION; GRAPHENE; HEATING; PHONONS; RAMAN SCATTERING; RAMAN SPECTROSCOPY; SCANNING;

ACOUSTIC SPECTROSCOPY;

EID: 79951527277     PISSN: 15306984     EISSN: 15306992     Source Type: Journal    
DOI: 10.1021/nl102858c     Document Type: Article

References (29)

1. Geim, A. K.; Novoselov, K. S. Nat. Mater. 2007, 6, 183-191.
2. Lin, Y. M.; Jenkins, K. A.; Valdes-Garcia, A.; Small, J. P.; Farmer, D. B.; Avouris, P. Nano Lett. 2009, 9, 422-426.
3. Bae, M. H.; Ong, Z. Y.; Estrada, D.; Pop, E. Nano Lett. 2010, DOI: 10.1021/nl1011596.
4. Berciaud, S.; Han, M. Y.; Mak, K. F.; Brus, L. E.; Kim, P.; Heinz, T. F. Phys. Rev. Lett. 2010, 104, 227401.
5. Chae, D. H.; Krauss, B.; von Klitzing, K.; Smet, J. H. Nano Lett 2010, 10, 466-471.
6. Freitag, M.; Chiu, H. Y.; Steiner, M.; Perebeinos, V.; Avouris, P. Nat. Nanotechnol. 2010, 5, 497-501.
7. Freitag, M.; Steiner, M.; Martin, Y.; Perebeinos, V.; Chen, Z. H.; Tsang, J. C.; Avouris, P. Nano Lett. 2009, 9, 1883-1888.
8. Calizo, I.; Miao, F.; Bao, W.; Lau, C. N.; Balandin, A. A. Appl. Phys. Lett. 2007, 91, No. 071913.
9. Basko, D. M.; Piscanec, S.; Ferrari, A. C. Phys. Rev. B 2009, 80, 165413.
10. Bonini, N.; Lazzeri, M.; Marzari, N.; Mauri, F. Phys. Rev. Lett. 2007, 99, 176802.
11. Das, A.; Pisana, S.; Chakraborty, B.; Piscanec, S.; Saha, S. K.; Waghmare, U. V.; Novoselov, K. S.; Krishnamurthy, H. R.; Geim, A. K.; Ferrari, A. C.; Sood, A. K. Nat. Nanotechnol. 2008, 3, 210-215.
12. Prasher, R. Appl. Phys. Lett. 2009, 94, No. 041905.
13. Seol, J. H.; Jo, I.; Moore, A. L.; Lindsay, L.; Aitken, Z. H.; Pettes, M. T.; Li, X. S.; Yao, Z.; Huang, R.; Broido, D.; Mingo, N.; Ruoff, R. S.; Shi, L. Science 2010, 328, 213-216.
14. Shi, L.; Majumdar, A. J. Heat Transfer - Trans. ASME 2002, 124, 329-337.
15. Shi, L.; Zhou, J. H.; Kim, P.; Bachtold, A.; Majumdar, A.; McEuen, P. L. J. Appl. Phys. 2009, 105, 104306.
16. Kim, K.; Chung, J.; Won, J.; Kwon, O.; Lee, J. S.; Park, S. H.; Choi, Y. K. Appl. Phys. Lett. 2008, 93, 203115.
17. Kim, S.; Nah, J.; Jo, I.; Shahrjerdi, D.; Colombo, L.; Yao, Z.; Tutuc, E.; Banerjee, S. K. Appl. Phys. Lett. 2009, 94, No. 062107.
18. Cahill, D. G.; Bullen, A.; Lee, S. M. High Temp. - High Pressures 2000, 32, 135-142.
19. Kading, O. W.; Skurk, H.; Goodson, K. E. Appl. Phys. Lett. 1994, 65, 1629-1631.
20. Kim, J. H.; Feldman, A.; Novotny, D. J. Appl. Phys. 1999, 86, 3959-3963.
21. Yamane, T.; Nagai, N.; Katayama, S.; Todoki, M. J. Appl. Phys. 2002, 91, 9772-9776.
22. Schmidt, A. J.; Chen, X. Y.; Chen, G. Rev. Sci. Instrum. 2008, 79, 114902.
23. Chen, Z.; Jang, W.; Bao, W.; Lau, C. N.; Dames, C. Appl. Phys. Lett. 2009, 95, 161910.
24. Lafkioti, M.; Krauss, B.; Lohmann, T.; Zschieschang, U.; Klauk, H.; von Klitzing, K.; Smet, J. H. Nano Lett. 2010, 10, 1149-1153.
25. Zilker, S. J.; Detcheverry, C.; Cantatore, E.; de Leeuw, D. M. Appl. Phys. Lett. 2001 , 79, 1124-1126.
26. Asheghi, M.; Kurabayashi, K.; Kasnavi, R.; Goodson, K. E. J. Appl. Phys. 2002, 91, 5079-5088.
27. Ferrari, A. C.; Meyer, J. C.; Scardaci, V.; Casiraghi, C.; Lazzeri, M.; Mauri, F.; Piscanec, S.; Jiang, D.; Novoselov, K. S.; Roth, S.; Geim, A. K. Phys. Rev. Lett. 2006, 97, 187401.
28. g, the thermal resistance of the relatively thick metal electrodes of high thermal conductivity is negligible, as verified by the negligible heating measured on top of the metal electrodes by SThM.
29. Incropera, F. P.; Dewitt, D. P.; Bergman, T. L.; Lavine, A. S. Fundamentals of Heat and Mass Transfer; John Wiley & Sons: New York, 2007; pp 210.