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Volumn 20, Issue 1, 2011, Pages 48-56
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Thermal modeling of direct digital melt-deposition processes
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Author keywords
melt deposition; microstructure; solidification; thermal modeling
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Indexed keywords
ADDITIVE MANUFACTURING;
ALGORITHMIC FRAMEWORK;
ANISOTROPIC DIFFUSIVITY;
COMPLEX GEOMETRIES;
DEPOSITION PROCESS;
DIGITAL MANUFACTURING;
ENERGY DEPOSITIONS;
FREEFORMS;
FUNCTIONALLY GRADIENT MATERIALS;
HEAT DIFFUSIONS;
INHERENT COMPLEXITY;
INTEGRAL FORMULATIONS;
LAYER-BY-LAYERS;
MATERIAL COMPOSITIONS;
MELT DEPOSITION;
MULTIPLE MATERIALS;
PARAMETER SENSITIVITIES;
PHYSICS-BASED;
PROCESS MODELING;
SPATIAL VARIATIONS;
TEMPERATURE DEPENDENT;
THERMAL MODEL;
THERMAL MODELING;
THERMO-PHYSICAL PROPERTY;
THREE-DIMENSIONAL (3D) OBJECTS;
TOOLPATHS;
WEAR-RESISTANT;
WORK PIECES;
DEPOSITION;
INVERSE PROBLEMS;
MANUFACTURE;
MICROSTRUCTURE;
SENSITIVITY ANALYSIS;
SOLIDIFICATION;
THERMOANALYSIS;
THERMODYNAMIC PROPERTIES;
THREE DIMENSIONAL;
DISSIMILAR MATERIALS;
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EID: 79851515756
PISSN: 10599495
EISSN: None
Source Type: Journal
DOI: 10.1007/s11665-010-9659-4 Document Type: Article |
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Times cited : (7)
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References (7)
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