Stress-strain behavior of shape memory polymers by 1 WE method: Application to tecoflex®

Journal of Macromolecular Science, Part A: Pure and Applied Chemistry

Volumn 48, Issue 3, 2011, Pages 204-210

  Schmidt, Christina ^a   Chowdhury, A M Sarwaruddin ^a,b   Neuking, Klaus ^a   Eggeler, Gunther ^a  

^a RUHR UNIVERSITY BOCHUM   (Germany)

^b UNIVERSITY OF DHAKA   (Bangladesh)

Author keywords

Shape memory polymers; stress and strain; Tecoflex ; thermomechanical cycles

Indexed keywords

IRREVERSIBLE STRAIN; RECOVERY RATIO; RECOVERY TIME; SCANNING ELECTRON MICROSCOPIC; SECONDARY ELECTRON IMAGING; SHAPE MEMORY POLYMERS; STRESS AND STRAIN; STRESS-STRAIN BEHAVIORS; TECOFLEX; THERMOMECHANICAL CYCLES;

HEATING; POLYMERS; SECONDARY EMISSION; SHAPE MEMORY EFFECT; SURFACE STRUCTURE; THERMOMECHANICAL TREATMENT; UNLOADING;

STRAIN;

EID: 79551710630     PISSN: 10601325     EISSN: 15205738     Source Type: Journal    
DOI: 10.1080/10601325.2011.544630     Document Type: Article

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