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Volumn 5, Issue PART 2, 2010, Pages 561-572
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A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology
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Author keywords
Laser structuring and metallization; Molded interconnect device (MID); Rapid prototyping (RP); Selective laser sintering (SLS)
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Indexed keywords
3D PRINTERS;
DENSITY (SPECIFIC GRAVITY);
ELECTRONICS PACKAGING;
LASER HEATING;
MANUFACTURE;
METAL FORMING;
METALLIZING;
RAPID PROTOTYPING;
SINTERING;
SURFACE ROUGHNESS;
CHARACTERISTIC TEMPERATURE;
LASER STRUCTURING;
MELTING AND CRYSTALLIZATION;
METALLIZATION PROCESS;
MOLDED INTERCONNECT DEVICES;
RAPID PROTOTYPING TECHNOLOGY;
SELECTIVE LASER SINTERING;
SINTERING PROCESS;
INTEGRATED CIRCUIT INTERCONNECTS;
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EID: 79551706385
PISSN: 18753884
EISSN: 18753892
Source Type: Conference Proceeding
DOI: 10.1016/j.phpro.2010.08.084 Document Type: Conference Paper |
Times cited : (44)
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References (13)
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