Initial studies into the use of ultrasound to reduce process temperatures and chemical usage in the PCB desmear process

Circuit World

Volumn 37, Issue 1, 2011, Pages 15-23

  Cobley, Andrew J ^a   Edgar, Lindsay ^b   Goosey, Martin ^c,e   Kellner, Rod ^d   Mason, Timothy J ^a  

^a Institute for Clean Growth and Future Mobility   (United Kingdom)

^b GSPK Circuits Ltd   (United Kingdom)

^c MTG Research Ltd   (United Kingdom)

^d Env Aqua Solutions Ltd   (United Kingdom)

^e Institute of Circuit Technology   (United Kingdom)

Author keywords

Acoustics; Printed circuits; Surface properties of materials; Ultrasonics

Indexed keywords

CHEMICAL CONCENTRATIONS; DESIGN/METHODOLOGY/APPROACH; ELECTRONIC MANUFACTURING; FREE-BOARDS; HIGHER WEIGHT; LAMINATE MATERIALS; LOW TEMPERATURES; LOW-FREQUENCY ULTRASOUND; ORDER OF MAGNITUDE; PROCESS TEMPERATURE; PROCESSING TEMPERATURE; PRODUCTION CONDITION; SCANNING ELECTRON MICROSCOPES; SURFACE PROPERTIES OF MATERIALS; SURFACE-MODIFIED; THROUGH HOLE; ULTRASONIC PROCESS; WEIGHT LOSS;

PRINTED CIRCUIT MANUFACTURE; PROCESSING; SCANNING ELECTRON MICROSCOPY; SHOCK TESTING; SURFACE PROPERTIES; ULTRASONICS;

PRINTED CIRCUIT BOARDS;

EID: 79551504924     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056121111101241     Document Type: Article

References (10)

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10. Mason, T.J. and Lorimer, J.P. (2002), Applied Sonochemistry, Wiley, VCH.