Effect of carbon fiber surface treatment on Cu electrodeposition: The electrochemical behavior and the morphology of Cu deposits

Journal of Alloys and Compounds

Volumn 509, Issue 8, 2011, Pages 3532-3536

  Li, Weiwei ^a   Liu, Lei ^a   Zhong, Cheng ^a   Shen, Bin ^a   Hu, Wenbin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Electrochemical reactions; Oxidation; Photoelectron spectroscopies; Scanning electron microscopy

Indexed keywords

APPLIED VOLTAGES; ATOMIC RATIO; ELECTROCHEMICAL BEHAVIORS; ELECTROCHEMICAL REACTIONS; ELECTROCHEMICAL RESPONSE; FIBER SURFACE TREATMENTS; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; OXIDATION TEMPERATURE; OXIDATION TREATMENTS; PLATING BATH; PLATING SOLUTIONS; SURFACE FUNCTIONAL GROUPS;

COPPER DEPOSITS; DEPOSITS; ELECTROCHEMICAL CORROSION; ELECTROCHEMISTRY; ELECTRONS; ELECTROPLATING; FUNCTIONAL GROUPS; MORPHOLOGY; OXIDATION; PHOTOELECTRICITY; PHOTONS; POLYACRYLONITRILES; SCANNING; SCANNING ELECTRON MICROSCOPY; SINGLE CRYSTAL SURFACES; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

CARBON FIBERS;

EID: 79551501113     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.12.170     Document Type: Article

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