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Volumn 37, Issue 1, 2011, Pages 38-45

Printable electronics: Towards materials development and device fabrication

Author keywords

Capacitors; Composite materials; Dielectric properties; Printed circuits; Resistors; Thin films

Indexed keywords

DEPOSITION METHODS; DESIGN/METHODOLOGY/APPROACH; DEVICE FABRICATIONS; DIELECTRIC CONSTANTS; DISCRETE RESISTORS; ELECTRICAL PROPERTY; ELECTRONIC APPLICATION; ELECTRONIC PACKAGING; EMBEDDED PASSIVES; EPOXY NANOCOMPOSITES; FLEXIBLE PRODUCTION; FLEXIBLE TECHNOLOGIES; FREQUENCY RANGES; GROWING DEMAND; HIGH FREQUENCY HF; HIGH-CAPACITANCE DENSITY; HIGH-DENSITY; INTER-LAYER DIELECTRICS; INTERCONNECT APPLICATIONS; LIGHTWEIGHT DEVICES; LOW LOSS; MATERIALS DEVELOPMENT; MICRO CONTACT PRINTING; MULTIPLE MATERIALS; NANO-MATERIALS; NANOCAPACITORS; NANOCOMPOSITE MATERIALS; ORGANICS; POLYMER NANOCOMPOSITE; POLYMERIC MATERIAL; PRESSURE COOKER TESTS; PRINTABLE ELECTRONICS; PRINTABLE MATERIALS; TEST VEHICLE; THERMOSETTING POLYMERS; VOLUME RESISTIVITY;

EID: 79551491369     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056121111101278     Document Type: Article
Times cited : (25)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.