Sub-imaging techniques for 3D-interconnects on bonded wafer pairs

AIP Conference Proceedings

Volumn 1300, Issue , 2010, Pages 221-228

  Kong, Lay Wai ^a   Krueger, Peter ^b   Zschech, Ehrenfried ^b   Rudack, Andrew C ^c   Arkalgud, Sitaram ^c   Diebold, Alain C ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b FRAUNHOFER INSTITUTE FOR NON DESTRUCTIVE TESTING   (Germany)

^c SEMATECH   (United States)

Author keywords

bonded wafer pair; high resolution X ray microscopy; overlay measurement; TSV; void inspection

Indexed keywords

EID: 79251555949     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3527129     Document Type: Conference Paper

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