The effect of imperfect bonding on the pull-out behavior of non-crimp fabric Pi-shaped joints

Computational Materials Science

Volumn 50, Issue 4, 2011, Pages 1372-1380

  Tserpes, K I ^a   Pantelakis, Sp ^a   Kappatos, V ^a  

^a UNIVERSITY OF PATRAS   (Greece)

Author keywords

Adhesive bonding; Finite element analysis; Non crimp fabrics; Non destructive testing; Pi shaped joints; Progressive failure analysis

Indexed keywords

ADHESIVE BONDING; FINITE ELEMENT ANALYSIS; NON DESTRUCTIVE TESTING; NON-CRIMP FABRICS; PI-SHAPED JOINTS; PROGRESSIVE FAILURE ANALYSIS;

FABRICS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MECHANICAL ENGINEERING; NONDESTRUCTIVE EXAMINATION; PREFORMING; STIFFNESS; ULTRASONIC TESTING;

QUALITY ASSURANCE;

EID: 79151484933     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2010.05.012     Document Type: Conference Paper

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