The mechanism of elevated temperature intergranular cracking in heat-resistant alloys

Materials Science and Engineering: A

Volumn 528, Issue 6, 2011, Pages 2678-2685

  Heo, N H ^a   Chang, J C ^a   Yoo, K B ^a   Lee, J K ^b   Kim, J ^c  

^a Korea Electric Power Research Institute (KEPRI)   (South Korea)

^b PILETA Co   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Electron microscopy; Fracture; Grain boundaries; Martensite; Steel; Welding

Indexed keywords

CARBIDES; CHROMIUM ALLOYS; CRACK PROPAGATION; DUCTILE FRACTURE; GRAIN GROWTH; STRESS RELIEF; TELLURIUM COMPOUNDS; TENSILE STRESS; TUNGSTEN ALLOYS;

ELEVATED TEMPERATURE; FREE GRAINS; GRAIN BOUNDARY CARBIDES; GRAIN-BOUNDARIES; HEAT-RESISTANT ALLOY; INTERGRANULAR CRACKING; INTERGRANULAR FAILURES; RUPTURE TESTS; TEST TIME; WELDING;

GRAIN BOUNDARIES;

EID: 79151479578     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.12.025     Document Type: Article

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