High-temperature (>l500°C) wall thickness monitoring using dry-coupled ultrasonic waveguide transducers

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 58, Issue 1, 2011, Pages 156-167

  Cegla, Frederic B ^a   Cawley, Peter ^a   Allin, Jonathan ^b   Davies, Jacob ^b  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

^b Permasense Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANTI-PLANE; CENTER FREQUENCY; COOLING EQUIPMENT; DIFFERENTIAL THERMAL EXPANSION; GUIDED WAVE MODES; HIGH TEMPERATURE; HIGH TEMPERATURE MEASUREMENT; JOINING METHOD; PIEZOELECTRIC ELEMENTS; RECTANGULAR CROSS-SECTIONS; RECTANGULAR STRIPS; SHEAR LOADINGS; SHORT DISTANCES; SIGNAL DEGRADATION; SYSTEM USE; TEMPERATURE GRADIENT; ULTRASONIC THICKNESS; WALL THICKNESS;

ASPECT RATIO; PIEZOELECTRIC DEVICES; PIEZOELECTRICITY; TEMPERATURE MEASUREMENT; THERMAL EXPANSION; TRANSDUCERS; ULTRASONIC TRANSDUCERS; ULTRASONIC WAVES; ULTRASONICS; WALLS (STRUCTURAL PARTITIONS); WAVE PROPAGATION;

WAVEGUIDES;

EID: 78751653199     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/TUFFC.2011.1782     Document Type: Article

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