Effects of Porous Alumina Support and Plating Time on Electroless Plating of Palladium Membrane

Journal of Materials Science and Technology

Volumn 26, Issue 12, 2010, Pages 1148-1152

  Kitiwan, Mettaya ^a   Atong, Duangduen ^a  

^a NATIONAL METAL AND MATERIALS TECHNOLOGY CENTER   (Thailand)

Author keywords

Electroless plating; Palladium composite membrane; Tubular porous support

Indexed keywords

ALUMINA TUBE; CERAMIC SUPPORTS; DEFECT-FREE; DENSE LAYER; DEPOSITED FILMS; ETHYLENEDIAMINETETRAACETIC ACID; HIGH SELECTIVITY; HYDROGEN PERMEABILITY; HYDROGEN PERMEATION; HYDROGEN SEPARATION; LOW POROSITY; MEMBRANE MORPHOLOGY; PALLADIUM ACETATE SOLUTIONS; PALLADIUM COMPLEXES; PALLADIUM COMPOSITE MEMBRANE; PALLADIUM FILMS; PALLADIUM MEMBRANE; PLATING BATH; POROUS ALUMINA; POROUS ALUMINA SUPPORTS; POROUS SUPPORT; SEPARATION FACTORS;

CERAMIC MEMBRANES; COMPOSITE MEMBRANES; DEFECTS; ELECTROLESS PLATING; ELECTROPLATING; FILM PREPARATION; HYDRAZINE; HYDROGEN; MORPHOLOGY; PALLADIUM; PALLADIUM ALLOYS; PALLADIUM COMPOUNDS; PERMEATION;

ORGANOMETALLICS;

EID: 78751637373     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1005-0302(11)60016-9     Document Type: Article

References (22)

1. Kikuchi E. Catal. Today 2000, 56:97.
2. Lin Y.M., Rei M.H. Sep. Purif. Technol. 2001, 25:87.
3. Holleck G.L. J. Phys. Chem. 1970, 74(3):503.
4. Zoltowski P. J. Electroanal. Chem. 2007, 600:54.
5. Itoh N., Akiha T., Sato T. Catal. Today 2005, 104:231.
6. Xomeritakis G., Lin Y.S. J. Membr. Sci. 1997, 133:17.
7. Tosti S., Bettinali L., Castelli S., Sarto F., Scaglione S., Violante V. J. Membr. Sci. 2002, 196:241.
8. Cheng Y.S., Yeung K.L. J. Membr. Sci. 1999, 158:127.
9. Yeung K.L., Christiansen S.C., Varma A. J. Membr. Sci. 1999, 159:107.
10. Tanaka D.A.P., Tanco M.A.L., Niwa S., Wakui Y., Mizukamia F., Namba T., Suzuki T.M. J. Membr. Sci. 2005, 247:21.
11. Itoh N., Toumura N., Tsuji T., Hongo M. Microporous Mesoporous Mat. 2000, 32:103.
12. Li A., Grace J.R., Lim C.J. J. Membr. Sci. 2007, 306:159.
13. Bissett H., Zah J., Krieg H.M. Powder Technol. 2008, 181:57.
14. Bosko M., Yepes D., Irusta S., Eloy P., Ruiz P., Lombardo E.A., Cornaglia L.M. J. Membr. Sci. 2007, 306:56.
15. Iwuchukwu I.J., Sheth A. Chem. Eng. Proc. 2008, 47:1292.
16. Barker B.D. Surf. Technol. 1981, 12:77.
17. Cheng Y.S., Yeung K.L. J. Membr. Sci. 2001, 182:195.
18. Yeung K.L., Christiansen S.C., Varma A. J. Membr. Sci. 1999, 159:122.
19. Meinema H.A., Dirrix R.W.J., Brinkman H.W., Terpstra R.A., Jekerle J., Kosters P.H. Interceram 2005, 54:86.
20. Kim K.H., Cho S.J., Yoon K.J., Kim J.J., Ha J., Chun D. J. Membr. Sci. 2002, 199:69.
21. Huang Y., Shu S., Lu Z., Fan Y. Thin Solid Films 2007, 515:5233.
22. Huang T.C., Wie M.C., Chen H.I. Sep. Sci. Technol. 2001, 36(2):199.