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Physica Status Solidi (B) Basic Research

Volumn 248, Issue 1, 2011, Pages 140-147

Coefficient of thermal expansion of stacked auxetic and negative thermal expansion laminates

(1) Lim, Teik Cheng a

a SINGAPORE UNIVERSITY OF SOCIAL SCIENCES (Singapore)

Author keywords

Auxetic; Laminate; Negative thermal expansion

Indexed keywords

EID: 78651305155 PISSN: 03701972 EISSN: 15213951 Source Type: Journal
DOI: 10.1002/pssb.200983970 Document Type: Article

Times cited : (36)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.