Multi-physics modeling of through-silicon vias with equivalent-circuit approach

2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

Volumn , Issue , 2010, Pages 33-36

  Liu, En Xiao ^a   Li, Er Ping ^a   Ewe, Wei Bin ^a   Lee, Hui Min ^a  

^a INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

Compact equivalent circuit; Electromagnetic modeling; Multiphysics modeling; Semiconductor physics; Surface wave transmission line; Thermal modeling; Through silicon via

Indexed keywords

CHIP SCALE PACKAGES; COMPUTATIONAL ELECTROMAGNETICS; EQUIVALENT CIRCUITS; INTEGRATED CIRCUIT INTERCONNECTS; SURFACE WAVES; TIMING CIRCUITS; WAVE TRANSMISSION;

ELECTROMAGNETIC MODELING; MULTI-PHYSICS MODELING; SEMICONDUCTOR PHYSICS; THERMAL MODEL; THROUGH-SILICON-VIA;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 78650956965     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEPS.2010.5642537     Document Type: Conference Paper

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