Smart materials of cured epoxy polymer modified by 6F-PEEK with shape memory effect

Advanced Materials Research

Volumn 152-153, Issue , 2011, Pages 530-535

  Gao, Junpeng ^a   Zhang, Chenqian ^a   He, Xiancheng ^a   Ma, Hongyi ^a   An, Xuefeng ^a   Yi, Xiaosu ^a   Dang, Guodong ^b   Chen, Chunhai ^b  

^a BEIJING INSTITUTE OF AERONAUTICAL MATERIALS   (China)

^b JILIN UNIVERSITY   (China)

Author keywords

6F PEEK; Epoxy resin; Shape memory effect

Indexed keywords

6F-PEEK; BLENDED MATERIALS; CURED EPOXY; FORMING PHASE; PERMANENT SHAPES; SHAPE MEMORY; SHAPE RECOVERY RATE; SHAPE RETENTION; SMART MATERIALS; THERMALLY INDUCED; THERMOSETTING EPOXY POLYMERS; TRANSITION TEMPERATURE; TWO GLASS TRANSITION;

CURING; EPOXY RESINS; ETHERS; GLASS TRANSITION; KETONES; MARTENSITIC TRANSFORMATIONS; MATERIALS; MECHANICAL PROPERTIES; SHAPE OPTIMIZATION; SYNTHETIC RESINS; TEMPERATURE; THERMOSETS;

SHAPE MEMORY EFFECT;

EID: 78650928864     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.152-153.530     Document Type: Conference Paper

References (12)

1. A. Lendlein, S. Kelch, Angew. Chem. Int. Ed. 2002, Vol. 41, 2034-2057.
2. K. Otsuka, C. M. Wayman, Shape memory materials, Cambridge University Press, 1998.
3. M.V. Gandhi, B.S. Thompson, SmartMaterialStructure, Chapman and Hall: New York, 1992.
4. Z. G.Wei, R. J. Sandstrom, Mater Sci 1998, 33, 3743.
5. J. R. Lin, L.W. Chen, J. Appl. Polym. Sci. 1998, Vol. 69, 1563-1574.
6. J. R. Lin, L.W. Chen, J. Appl. Polym. Sci. 1998, Vol. 69, 1575-1586.
7. B. K. Kim, S. Y. Lee, M. Xu, Polymer 1996, Vol. 37, 5781-5793.
8. R. E. Abrahamson, M. S. Lake, N. A. Munshi, K. Gall, American Institute of Aeronautics and Astronautics, AIAA-2002-1562.
9. G. V. Bejoy, G. G. Fabrice, V. Lakshmana, Polymer, 2003, Vol. 44, 3687-3699.
10. T. Yoon, B. S. Kim, D. S. Lee, Journal of Applied Polymer Science, 1997, Vol. 66, 2233-2242.
11. G. D. Merfeld, G. W. Yeager, H.S. Chao, N. Singh, Polymer, 2003, Vol. 44, 4981-4992.
12. C. C. Su and E. M. Woo, Polymer, 1995, Vol. 36, 2883-2894.