Application of the ultrasound-infrared thermography technique for non-destructive evaluation of defects in shoe bonding parts

Advanced Materials Research

Volumn 123-125, Issue , 2010, Pages 823-826

  Choi, Seung Hyun ^a   Kwac, Lee Ku ^b   Kim, Jea Youl ^a  

^a Chosun University   (South Korea)

^b Jeonju University   (South Korea)

Author keywords

Delamination; NDE; Shoes bonded area; Ultrasound infrared thermography

Indexed keywords

INFRARED THERMAL-CAMERA; INFRARED THERMOGRAPHY; INSPECTION SYSTEM; LOCAL HEAT; NDE; NON DESTRUCTIVE EVALUATION; NON DESTRUCTIVE INSPECTION; NON-DESTRUCTIVE EVALUATION METHODS; SHOES BONDED AREA; STUDY AREAS; SYSTEM CONFIGURATIONS; ULTRASOUND WAVES;

CRACKS; FUNCTIONAL MATERIALS; INSPECTION; STEEL SHEET; SURFACE DEFECTS; THERMOGRAPHY (IMAGING); THERMOGRAPHY (TEMPERATURE MEASUREMENT); ULTRASONICS;

ULTRASONIC APPLICATIONS;

EID: 78650740173     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.123-125.823     Document Type: Conference Paper

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