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Journal of Thermal Analysis and Calorimetry
Volumn 102, Issue 3, 2010, Pages 915-922
Curing behavior of epoxy resins with a series of novel curing agents containing 4,4′-biphenyl and varying methylene units
Author keywords

Curing agent; Curing behavior; Curing kinetics; DSC; TG
Indexed keywords

CURING AGENTS; CURING BEHAVIOR; CURING KINETICS; DSC; TG;
EID: 78650722733     PISSN: 13886150     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10973-010-0764-2     Document Type: Article
Times cited : (21)
References (30)
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