Low-temperature sintering and microwave dielectric properties of TiO 2-based LTCC materials

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 12, 2010, Pages 1285-1292

  Pang, Li Xia ^a   Wang, Hong ^a   Zhou, Di ^a   Yao, Xi ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATRIX; CO-FIRE; COMPATIBILITY TEST; CRYSTALLINE PHASIS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; FABRICATION PROCESS; HIGH DIELECTRIC CONSTANTS; HIGH QUALITY FACTORS; LOW-TEMPERATURE SINTERING; MICROWAVE DIELECTRIC PROPERTIES; NEAR-ZERO TEMPERATURE; RUTILE TIO; SILVER ELECTRODE; TEMPERATURE STABLE; TIO;

CERAMIC MATERIALS; CRYSTALLINE MATERIALS; MICROSTRUCTURE; NATURAL FREQUENCIES; OXIDE MINERALS; SCANNING ELECTRON MICROSCOPY; SINTERING; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; X RAY SPECTROSCOPY;

DIELECTRIC PROPERTIES;

EID: 78650715155     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-010-0064-4     Document Type: Article

References (20)

1. R.L. Brown, W.R. Smith, in Proceedings of International Conference on Multichip Modules, (IEEE press, New York 1997) pp. 351-356
2. B Geller B Thaler A Fathy MJ Libertatore HD Chen G Ayers V Pendrick Y Narayan 1999 Microwave J. 42 64
3. DL Wilcox R Huang SX Dai 1999 Ceram. Trans. 97 201 1:CAS:528: DyaK1MXlvFejtr4%3D
4. Y Zheng XZ Zhao W Lei SX Wang 2006 Mater. Lett. 60 459 1:CAS:528:DC%2BD2MXht1Ois7jK 10.1016/j.matlet.2005.09.012 (Pubitemid 41705722)
5. LC Chang BS Chiou 2004 J. Electroceram. 13 829 1:CAS:528: DC%2BD2MXhtVCgs7s%3D 10.1007/s10832-004-5200-1 (Pubitemid 40493680)
6. A Templeton X Wang SJ Penn SJ Webb LF Cohen NM Alford 2000 J. Am. Ceram. Soc. 83 95 1:CAS:528:DC%2BD3cXmvFejsA%3D%3D 10.1111/j.1151-2916.2000.tb01154.x
7. K Fukuda R Kitoh I Awai 1993 Jpn. J. Appl. Phys. 32 4584 1:CAS:528:DyaK2cXht1agt78%3D 10.1143/JJAP.32.4584 1993JaJAP..32.4584F
8. AK Axelsson M Sebastian NM Alford 2003 J. Korean Ceram. Soc. 40 340 1:CAS:528:DC%2BD3sXjvFaqs7c%3D 10.4191/KCERS.2003.40.4.340
9. DW Kim B Park JH Chung KS Hong 2000 Jpn. J. Appl. Phys. 39 2696 1:CAS:528:DC%2BD3cXjs12itrs%3D 10.1143/JJAP.39.2696 2000JaJAP..39.2696K
10. CK Shin YK Paek 2006 Int. J. Appl. Ceram. Technol. 3 463 1:CAS:528:DC%2BD28XhtlGqs7rL 10.1111/j.1744-7402.2006.02106.x (Pubitemid 44803939)
11. CL Huang JT Tsai YB Chen 2001 Mater. Res. Bull. 36 547 1:CAS:528:DC%2BD3MXjtFehsbY%3D 10.1016/S0025-5408(01)00528-1 (Pubitemid 32415916)
12. ES Kim KH Yoon 2003 J. Eur. Ceram. Soc. 23 2397 1:CAS:528: DC%2BD3sXmtFant7g%3D 10.1016/S0955-2219(03)00192-4 (Pubitemid 37065596)
13. YC Liou WH Shiu CY Shih 2006 Mater. Sci. Eng. B 131 142 1:CAS:528:DC%2BD28XmsF2itbg%3D 10.1016/j.mseb.2006.04.011 (Pubitemid 43974953)
14. M Valant D Suvorov 2000 J. Am. Ceram. Soc. 83 2721 1:CAS:528: DC%2BD3cXot1Sjsbw%3D 10.1111/j.1151-2916.2000.tb01623.x
15. MA Subramanian L Dong N Duan BA Reisner AW Sleight 2000 J. Solid State Chem. 151 323 1:CAS:528:DC%2BD3cXis1OqsLY%3D 10.1006/jssc.2000.8703 2000JSSCh.151..323S
16. JJ Liu CG Duan WG Yin WN Mei RW Smith JR Hardy 2004 Phys. Rev. B 70 144106 10.1103/PhysRevB.70.144106 2004PhRvB..70n4106L (Pubitemid 40052567)
17. SJ Penn NM Alford A Templeton X Wang M Xu M Reece K Schrapel 1997 J. Am. Ceram. Soc. 80 1885 1:CAS:528:DyaK2sXks1alt74%3D 10.1111/j.1151-2916.1997. tb03066.x
18. RC Pullar SJ Penn XR Wang IM Reaney NM Alford 2009 J. Eur. Ceram. Soc. 29 419 1:CAS:528:DC%2BD1cXhsVWjtrzJ 10.1016/j.jeurceramsoc.2008.06.019
19. YG Wu XH Zhao F Li ZG Fan 2003 J. Electroceram. 11 227 10.1023/B:JECR.0000026377.48598.4d
20. L.X. Pang, H. Wang, D. Zhou, X. Yao, J. Alloy. Compd. (accept)