Future direction of direct writing

Journal of Applied Physics

Volumn 108, Issue 10, 2010, Pages

  Kim, Nam Soo ^a   Han, Kenneth N ^b  

^a University of Texas at El Paso   (United States)

^b Seokyeong University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE INK; DENTAL APPLICATIONS; DIRECT WRITE; DIRECT WRITING; DIRECT-WRITE TECHNOLOGY; DISPERSED METALS; DRAWING PATTERN; E-PAPERS; ELECTRONIC INDUSTRIES; FLIP CHIP; FUTURE DIRECTIONS; HIGH VISCOSITIES; INK JET TECHNOLOGY; MASK LESS; MATERIALS DEPOSITION; MESOSCALE; MICRO-DISPENSING; NANO-METAL; NANOINKS; RFID-TAG; THREE-DIMENSION; UNDERFILLING;

FLEXIBLE DISPLAYS; INK; LIGHT EMITTING DIODES; MANUFACTURE; RADIO FREQUENCY IDENTIFICATION (RFID); REDUCING AGENTS; TECHNOLOGY;

ORGANIC LIGHT EMITTING DIODES (OLED);

EID: 78650282050     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3510359     Document Type: Conference Paper

References (41)

1. B. Li, P. A. Clark, and K. H. Church, Proceedings of the 2007 International Manufacturing Science and Engineering Conference (MSEC), Atlanta, GA, USA, 15-17 October 2007.
2. Optomec, Inc., www.optomec.com, 2006.
3. Ulvac Technologies, http://www.ulvac.com/materials targets/nano.asp
4. Cabot-Corp., http://www.cabot-corp.corp/wcm/download/en-us/nb/ CCI%20Data%20Sheet%207-12-07 PEM.pdf
5. Collins Ink Corporation, http://www.collinsink.com/Kodak catalog electronic.pdf
6. NanoMas, Inc., http://www.nanomastech.eom/products.html#nanosilver
7. Harima Chemical, http://www.harima.co.ip/en/products/electronics/products en.html#npseries
8. InkTeck Inc., http://www.inktec.com/down/pdf/TEC ink 2.1.PDF
9. Anp, Inc., http://www.anapro.com/english/product/anti-reilection- coatings.asp
10. K. W. Whites, T. Amert, S. Woessner, N. S. Kim, S. Decker, and J. Kellar, 2007 IEEE AP-S International Symposium on Antennas and Propagation, Honolulu, USA, 10-15 June 2007.
11. K. W. Whites, T. Amert, N. S. Kim, K. Han, J. Kellar, and S. Decker, Dig. USNC/URSI National Radio Science Meeting, Albuquerque, NM, 9-14 July 2006, p. 414.
12. N. S. Kim, A. K. Amert, S. M. Woessner, S. Decker, S. M. Kang, and K. N. Han International Conference on Nano Science and Nano Technology, GJ-NST 2006, Korea Institute Industrial Technology,Gwangju, South Korea, 7-8 December 2006.
13. N. S. Kim (unpublished).
14. B. Li, P. A. Clark, and K. H. Church, MRS Spring Meeting, 2007.
15. K. J. Daun, B. J. Stagg, F. Liu, G. J. Smallwood, and D. R. Snelling, Appl. Phys. B: Lasers Opt. APBOEM 0946-2171 87, 363 (2007). 10.1007/s00340-007- 2585-y (Pubitemid 46645866)
16. K. N. Han, Fundamentals of Aqueous Metallurgy (SME, Denver, 2002), p. 212.
17. CRC Handbook of Chemistry and Physics, edited by, R. C. West, (CRC, Boca Raton, Florida, USA, 1985), p. I-37.
18. K. N. Han, N. S. Kim, and H. J. Lee, " Manufacturing of nano-metal powders in aqueous media.," Enbion Report, 2005 (unpublished).
19. S. Gomez, K. Philippot, V. Colliere, B. Chaudret, F. Senocq, and P. Lecante, Chem. Commun. 5 (19), 1945 (2000). 10.1039/B0053271
20. K. S. Chou and C. Y. Ren, Mater. Chem. Phys. MCHPDR 0254-0584 64, 241 (2000). 10.1016/S0254-0584(00)00223-6
21. S. D. Solomon, M. Bahadory, A. V. Jeyarajasingam, S. A. Rutkowsky, C. Boritz, and L. Mulfinger, J. Chem. Educ. JCEDA8 0021-9584 84 (2), 322 (2007). 10.1021/ed084p322
22. S. -H. Wu and D. -H. Chen, J. Colloid Interface Sci. JCISA5 0021-9797 273, 165 (2004). 10.1016/j.jcis.2004.01.071 (Pubitemid 38407382)
23. M. Aslam, L. Fu, M. Su, K. Vijayamohanan, and V. P. Dravid, J. Mater. Chem. JMACEP 0959-9428 14, 1795 (2004). 10.1039/b402823f
24. P. K. Khanna, T. S. Kale, M. Shaikh, N. K. Rao, and C. V. V. Satyanarayana, Mater. Chem. Phys. MCHPDR 0254-0584 110, 21 (2008). 10.1016/j.matchemphys.2008.01.013
25. J. -G. Yang, T. Okamoto, R. Ichino, T. Bessho, S. Satake, and M. Okido, Chem. Lett. CMLTAG 0366-7022 35 (6), 648 (2006). 10.1246/cl.2006.648 (Pubitemid 44306366)
26. P. K. Khanna, N. Singh, D. Kulkarni, S. Deshmukh, S. Charan, and P. V. Adhyapaka, Mater. Lett. MLETDJ 0167-577X 61, 3366 (2007). 10.1016/j.matlet.2006. 11.064 (Pubitemid 46734432)
27. J. Turkevich, G. Garton, and P. C. Stevenson, J. Colloid Sci. JCSCA7 0095-8522 9, 26 (1954). 10.1016/0095-8522(54)90070-7
28. D. A. Handley, in Colloid Gold: Principles, Methods and Applications, edited by, M. A. Hayat, (Academic, San Diego, 1989), Vol. 1, pp. 13-32.
29. D. G. Duff, A. Baiker, and P. P. Edwards, Langmuir LANGD5 0743-7463 9, 2301 (1993). 10.1021/la00033a010
30. M. Pourbaix, Atlas of Electrochemical Equilibria (NACE, Houston, USA, 1974), p. 644.
31. http://www.standnes.no/chemix/periodictable/electrical-conductivitv- elements.htm
32. W. Zhang, X. Qiao, and J. Chen, Mater. Sci. Eng., B MSBTEK 0921-5107 142, 1 (2007). 10.1016/j.mseb.2007.06.014 (Pubitemid 47268143)
33. A. Silcikaite, I. Prosycevas, J. Puiso, A. Jurfaitis, and A. Guobiene, Mater. Sci. MSCJDS 0137-1339 12 (4), 287 (2006).
34. C. Luo, Y. Zhang, X. Zeng, Y. Zeng, and Y. Wang, J. Colloid Interface Sci. JCISA5 0021-9797 288, 444 (2005). 10.1016/j.jcis.2005.03.005 (Pubitemid 40779544)
35. T. K. Sau, A. Pal, N. R. Jana, Z. L. Wang, and T. Pal, J. Nanopart. Res. JNARFA 1388-0764 3, 257 (2001). 10.1023/A:1017567225071
36. S.-Y. Zhao, S-H. Chen, D.-G. Li, X.-G. Yang, and H.-Y. Ma, Physica E (Amsterdam) PELNFM 1386-9477 23, 92 (2004). 10.1016/j.physe.2004.01.008
37. H. H. Park, J. Won, S. -G. Oh, and Y. S. Kang, J. Membr. Sci. JMESDO 0376-7388 217, 285 (2003). 10.1016/S0376-7388(03)00146-7 (Pubitemid 36629394)
38. N. S. Kim, A. K. Amert, S. M. Woessner, S. Decker, S. -M. Kang, and K. N. Han, J. Nanosci. Nanotechnol. JNNOAR 1533-4880 7 (11), 3902 (2007). 10.1166/jnn.2007.071
39. S. P. Friedman, Comput. Electron. Agric. CEAGE6 0168-1699 46, 45 (2005). 10.1016/j.compag.2004.11.001 (Pubitemid 40257066)
40. R. K. McGeary, J. Am. Ceram. Soc. JACTAW 0002-7820 44, 513 (1961). 10.1111/j.1151-2916.1961.tb13716.x
41. F. Wang, S. Arai, K. C. Park, K. Takeuchi, and Y. J. Kim, Letters to Editor 44, 1298 (2006).