Study of dextrin-derived curing agent for waterborne epoxy adhesive

Carbohydrate Polymers

Volumn 83, Issue 3, 2011, Pages 1180-1184

  Liu, Xiaoqing ^a,b,c   Wang, Yi ^a   Cao, Yang ^a   Yadama, Vikram ^a   Xian, Ming ^b   Zhang, Jinwen ^a  

^a Washington State University   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

^c NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING   (China)

Author keywords

Dextrin; Formaldehyde; Waterborne epoxy; Wood adhesive

Indexed keywords

ADHESIVE SYSTEMS; CARBOXYLIC ACID GROUPS; CHEMICAL STRUCTURE; CURING AGENTS; DEXTRIN; EPOXY ADHESIVES; EPOXY SYSTEMS; PHENOL-FORMALDEHYDE RESIN; RESIN PENETRATION; WATERBORNE EPOXY; WOOD ADHESIVE; WOOD ADHESIVES; WOOD BONDING; WOOD SUBSTRATES;

ADHESIVES; CARBOXYLIC ACIDS; CURING; FORMALDEHYDE; PHENOLIC RESINS; PHENOLS; RESINS; VOLATILE ORGANIC COMPOUNDS; WOOD;

EPOXY RESINS;

ADHESIVES; CARBOXYLIC ACIDS; CURING; DEXTRINS; FORMALDEHYDE; PHENOLS; POLYEPOXIDES; VOC; WOOD;

EID: 78650265718     PISSN: 01448617     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.carbpol.2010.09.019     Document Type: Article

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