Effect of silane adhesion promoters on subcritical debonding of epoxy/glass interfaces after hygrothermal aging

Journal of Adhesion

Volumn 86, Issue 12, 2010, Pages 1178-1202

  Onjun, Orasa ^a   Pearson, Raymond A ^a  

^a LEHIGH UNIVERSITY   (United States)

Author keywords

Adhesion promoter; Epoxy; Glass and subcritical debonding; Hygrothermal aging; Organoilane

Indexed keywords

3-AMINOPROPYLTRIETHOXYSILANE; ADHESION PROMOTER; ADHESIVE APPLICATIONS; AGING TIME; BISPHENOL F; CURING AGENTS; EPOXY; EPOXY SYSTEMS; GLASS SURFACES; GLYCIDOXYPROPYLTRIMETHOXYSILANE; HYGRO-THERMAL CONDITIONS; HYGROTHERMAL AGING; INTERFACE CHEMISTRY; INTERFACE FRACTURE; INTERFACIAL CRACK GROWTH; MECHANICAL LOADS; MICROELECTRONIC PACKAGING; ORGANOILANE; ORGANOSILANES; POWER-LAW REGION; SUBCRITICAL DEBONDING; TIME-DEPENDENT;

ADHESION; CRACK PROPAGATION; CRACKS; CURING; ENERGY RELEASE RATE; EPOXY RESINS; FRACTURE; GLASS; MICROELECTRONICS; PHENOLS; SILANES; STRAIN ENERGY; STRAIN RATE; SYNTHETIC RESINS;

DEBONDING;

EID: 78650157641     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218464.2010.529382     Document Type: Article

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