-
1
-
-
0023994850
-
Communication network issues and high density interconnects in large-scale distributed computing systems
-
S. K. Tewksbury and L. A. Hornak, Communication network issues and high density interconnects in large-scale distributed computing systems, IEEE J. Selected Areas in Communications, vol. 6, p. 587, 1988.
-
(1988)
IEEE J. Selected Areas in Communications
, vol.6
, pp. 587
-
-
Tewksbury, S.K.1
Hornak, L.A.2
-
2
-
-
84958519304
-
Future physical environments and concurrent computations
-
S. K. Tewksbury, B. W. Dickinson and S. C. Schwartz Eds, Plenum Press
-
S. K. Tewksbury and L. A. Hornak, Future physical environments and concurrent computations, in Concurrent Computations: Algorithms, Architecture and Technology, S. K. Tewksbury, B. W. Dickinson and S. C. Schwartz (Eds), Plenum Press (1988).
-
(1988)
Concurrent Computations: Algorithms, Architecture and Technology
-
-
Tewksbury, S.K.1
Hornak, L.A.2
-
4
-
-
0022205669
-
The wafertransmission module - Wafer scale integration packaging
-
G. F. Taylor, B. J. Donlan, J. F. McDonald, A. S. Bergendahl and R. H. Steinvorth, The wafertransmission module - wafer scale integration packaging, Proc. IEEE Custom Int. Circuits Conf., pp. 55-58 (1985).
-
(1985)
Proc. IEEE Custom Int. Circuits Conf.
, pp. 55-58
-
-
Taylor, G.F.1
Donlan, B.J.2
McDonald, J.F.3
Bergendahl, A.S.4
Steinvorth, R.H.5
-
5
-
-
0024629335
-
Modeling of picosecond pulse propagation in microstrip interconnections on integrated circuits
-
K. W. Goosen and R. B. Hammond, Modeling of picosecond pulse propagation in microstrip interconnections on integrated circuits, IEEE Trans. Microwave Theory and Techniques, vol. MTT-37, pp. 469-478 (1989).
-
(1989)
IEEE Trans. Microwave Theory and Techniques
, vol.MTT-37
, pp. 469-478
-
-
Goosen, K.W.1
Hammond, R.B.2
-
6
-
-
0022783949
-
Transmission line models for lossy waveguide interconnections in VLSI
-
J. R. Brews, Transmission line models for lossy waveguide interconnections in VLSI, IEEE Trans. Electron Dev., vol. ED-33, pp. 1356-1365 (1986).
-
(1986)
IEEE Trans. Electron Dev.
, vol.ED-33
, pp. 1356-1365
-
-
Brews, J.R.1
-
7
-
-
0025452186
-
High speed signal propagation on lossy transmission lines
-
A. Deutsch et al, High speed signal propagation on lossy transmission lines, IBM J. Res. Develop, vol. 34, pp. 601-615 (1990).
-
(1990)
IBM J. Res. Develop
, vol.34
, pp. 601-615
-
-
Deutsch, A.1
-
8
-
-
0023363562
-
Electrical modeling of interconnections in multilayer packaging structures
-
O. Palusinski, J. C. Liao, P. E. Teschan, J. L. Prince and F. Quintero, Electrical modeling of interconnections in multilayer packaging structures, IEEE Trans. Components, Hybrids and Manuf. Technol., vol. CHMT-10, pp. 217-223 (1987).
-
(1987)
IEEE Trans. Components, Hybrids and Manuf. Technol.
, vol.CHMT-10
, pp. 217-223
-
-
Palusinski, O.1
Liao, J.C.2
Teschan, P.E.3
Prince, J.L.4
Quintero, F.5
-
9
-
-
0023314708
-
Analysis and modeling of multilevel parallel and crossing interconnection lines
-
V. K. Tripathi and R. J. Bucolo, Analysis and modeling of multilevel parallel and crossing interconnection lines, IEEE Trans. Electron Dev., vol. ED-34, pp. 650-658 (1987).
-
(1987)
IEEE Trans. Electron Dev.
, vol.ED-34
, pp. 650-658
-
-
Tripathi, V.K.1
Bucolo, R.J.2
-
10
-
-
0023313359
-
Modeling and measurement of contact resistances
-
W. M. Loh, S. E. Swirhun, T. A. Schreyer, R. M. Swanson and K. C. Saraswat, Modeling and measurement of contact resistances, IEEE Trans. Electron Dev., vol. ED-34, pp. 512-524 (1987).
-
(1987)
IEEE Trans. Electron Dev.
, vol.ED-34
, pp. 512-524
-
-
Loh, W.M.1
Swirhun, S.E.2
Schreyer, T.A.3
Swanson, R.M.4
Saraswat, K.C.5
-
11
-
-
0024072983
-
Performance limits of electrical interconnections to a high-speed chip
-
A. J. Rainal, Performance limits of electrical interconnections to a high-speed chip, IEEE Trans. Components, Hybrids and Manuf. Technol., vol. CHMT- 11, pp. 260-266 (1988).
-
(1988)
IEEE Trans. Components, Hybrids and Manuf. Technol.
, vol.CHMT- 11
, pp. 260-266
-
-
Rainal, A.J.1
-
12
-
-
0000097438
-
Characteristic impedance of integrated circuit wire bonds
-
R. H. Caverly, Characteristic impedance of integrated circuit wire bonds, IEEE Trans. Microwave Theory and Techniques, vol. MTT-34, pp. 982-984 (1986).
-
(1986)
IEEE Trans. Microwave Theory and Techniques
, vol.MTT-34
, pp. 982-984
-
-
Caverly, R.H.1
-
13
-
-
0023363897
-
High-frequency performance of TAB
-
D. Herrell and D. Carey, High-frequency performance of TAB, IEEE Trans. Components, Hybrids and Manuf. Technol., vol. CHMT-10, pp. 199-203 (1987).
-
(1987)
IEEE Trans. Components, Hybrids and Manuf. Technol.
, vol.CHMT-10
, pp. 199-203
-
-
Herrell, D.1
Carey, D.2
-
14
-
-
0024734472
-
The high-frequency characteristics of tape automated bonding (TAB) interconnects
-
S. M. Wentworth, D. P. Neikirk and C. R. Brahce, The high-frequency characteristics of tape automated bonding (TAB) interconnects, IEEE Trans. Components, Hybrids and Manuf. Technol., vol. 12, pp. 340-347 (1987).
-
(1987)
IEEE Trans. Components, Hybrids and Manuf. Technol.
, vol.12
, pp. 340-347
-
-
Wentworth, S.M.1
Neikirk, D.P.2
Brahce, C.R.3
-
15
-
-
0000325641
-
Effect of scaling of interconnections on the time delay of VLSI circuits
-
K. C. Saraswat and F. Mohammadi, Effect of scaling of interconnections on the time delay of VLSI circuits, IEEE J. Solid-State Circuits, vol. SC-17, pp. 275-280 (1982).
-
(1982)
IEEE J. Solid-state Circuits
, vol.SC-17
, pp. 275-280
-
-
Saraswat, K.C.1
Mohammadi, F.2
-
16
-
-
85067563650
-
3-D processor packaging and interconnect
-
S. N. Shanken, R. Some, and M. Suer, 3-D processor packaging and interconnect, Proc. GOMAC '91, pp. 151-154 (1991).
-
(1991)
Proc. GOMAC '91
, pp. 151-154
-
-
Shanken, S.N.1
Some, R.2
Suer, M.3
-
19
-
-
0023383979
-
On the feasibility of through-wafer optical interconnects for hybrid wafer-scale integrated architectures
-
L. A. Hornak and S. K. Tewksbury, On the feasibility of through-wafer optical interconnects for hybrid wafer-scale integrated architectures, IEEE Trans. Electron Dev., vol. ED-34, pp. 1557-1563 (1987).
-
(1987)
IEEE Trans. Electron Dev.
, vol.ED-34
, pp. 1557-1563
-
-
Hornak, L.A.1
Tewksbury, S.K.2
-
20
-
-
84975659844
-
Comparison between optical and electrical interconnects based on power and speed considerations
-
M. R. Feldman, S. C. Esener, C. C. Guest and S. H. Lee, Comparison between optical and electrical interconnects based on power and speed considerations, Applied Optics, vol. 27, pp. 1742-1751 (1988).
-
(1988)
Applied Optics
, vol.27
, pp. 1742-1751
-
-
Feldman, M.R.1
Esener, S.C.2
Guest, C.C.3
Lee, S.H.4
-
21
-
-
0023310207
-
Implementation of optical interconnections for VLSI
-
W. H. Wu, L. A. Bergman, A. R. Johnson, C. C. Guest, S. C. Esener, P. K L. Yu, M. R. Feldman and S. H. Lee, Implementation of optical interconnections for VLSI, IEEE Trans. Electron Dev., vol. ED-34, pp. 706-714 (1987).
-
(1987)
IEEE Trans. Electron Dev.
, vol.ED-34
, pp. 706-714
-
-
Wu, W.H.1
Bergman, L.A.2
Johnson, A.R.3
Guest, C.C.4
Esener, S.C.5
Yu, P.K.L.6
Feldman, M.R.7
Lee, S.H.8
-
22
-
-
84975613276
-
Optical interconnections for massively parallel architectures
-
A. Guha, J. Bristow, C. Sullivan and A. Husain, Optical interconnections for massively parallel architectures, Applied Optics, vol. 29, pp. 1077-1093 (1990).
-
(1990)
Applied Optics
, vol.29
, pp. 1077-1093
-
-
Guha, A.1
Bristow, J.2
Sullivan, C.3
Husain, A.4
-
23
-
-
84975659899
-
Parallel optical interconnects: Implementation of optoelectronics in multiprocessor architectures
-
E. E. Frietman, W. V. Nifterick, L. Kekker and T. J. M. Jongeling, Parallel optical interconnects: Implementation of optoelectronics in multiprocessor architectures, Applied Optics, vol. 29, pp. 1161-1177 (1990).
-
(1990)
Applied Optics
, vol.29
, pp. 1161-1177
-
-
Frietman, E.E.1
Nifterick, W.V.2
Kekker, L.3
Jongeling, T.J.M.4
-
24
-
-
84975597955
-
Optical imaging applied to microelectronic chip-to-chip interconnections
-
R. Kostuk, J. W. Goodman and L. Hesselink, Optical imaging applied to microelectronic chip-to-chip interconnections, Applied Optics, vol. 24, pp. 2851-2858 (1985).
-
(1985)
Applied Optics
, vol.24
, pp. 2851-2858
-
-
Kostuk, R.1
Goodman, J.W.2
Hesselink, L.3
-
25
-
-
0022797966
-
Digital high-speed interconnects: A study of the optical alternative
-
D. H. Hartman, Digital high-speed interconnects: A study of the optical alternative, Optical Engineering, vol. 25, pp. 1086-1102 (1986).
-
(1986)
Optical Engineering
, vol.25
, pp. 1086-1102
-
-
Hartman, D.H.1
-
26
-
-
0024018072
-
Integrated optical waveguides in polyimide for wafer scale integration
-
R. Selvaraj, H. T. Lin and J. F. McDonald, Integrated optical waveguides in polyimide for wafer scale integration, IEEE J. Lightwave Technol., vol. LT-6, pp. 1034-1044 (1988).
-
(1988)
IEEE J. Lightwave Technol.
, vol.LT-6
, pp. 1034-1044
-
-
Selvaraj, R.1
Lin, H.T.2
McDonald, J.F.3
-
29
-
-
0026172831
-
Vertical-cavity surface-emitting lasers: Design, growth, fabrication, characterization
-
J. L. Jewell, J. P. Harbison, A. Sherer, Y. H. Lee and L. T. Florez, Vertical-cavity surface-emitting lasers: Design, growth, fabrication, characterization, IEEE J. Quantum Electronics, vol. QE-27, p. 1332 (1991).
-
(1991)
IEEE J. Quantum Electronics
, vol.QE-27
, pp. 1332
-
-
Jewell, J.L.1
Harbison, J.P.2
Sherer, A.3
Lee, Y.H.4
Florez, L.T.5
|