Ni nanoparticles deposition onto CNTs by electroless plating

Materials Science Forum

Volumn 658, Issue , 2010, Pages 360-363

  Cho, Gue Serb ^a   Lim, Jung Kyu ^a   Choe, Kyeong Hwan ^a   Lee, Wonsik ^a  

^a Korea Institute of Industrial Technology   (South Korea)

Author keywords

CNTs; Electroless plating; Ni nanoparticles; Surfactant; Wet ball milling

Indexed keywords

DISPERSIONS; ELECTROLESS PLATING; FIELD EMISSION MICROSCOPES; MILLING (MACHINING); MULTIWALLED CARBON NANOTUBES (MWCN); NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SULFUR COMPOUNDS; SURFACE ACTIVE AGENTS;

CNTS; ELECTROLESS PLATING METHODS; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; NI ELECTROLESS PLATING; NI NANOPARTICLES; SPHEROIDIZATION; SULFATE SOLUTIONS; WET BALL MILLING;

BALL MILLING;

EID: 78649965096     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.658.360     Document Type: Conference Paper

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