Interface attachability analysis of printed patterns through electrostatic inkjet system

Innovative Developments in Design and Manufacturing - Advanced Research in Virtual and Rapid Prototyping

Volumn , Issue , 2010, Pages 377-380

  Ali, A ^a   Rahman, A ^a   Choi, K H ^a   Yang, B S ^a   Kim, D S ^b  

^a Jeju National University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION TEST; ATTACHABILITY; CONDUCTIVE INK; CONDUCTIVE LINES; DIFFERENT SUBSTRATES; ELECTROSTATIC INKJET; METALLIC PIGMENT; NON-CONTACT; PHOTO PAPERS; POLY(VINYL-CINNAMATE); PRINTED PATTERNS; RESEARCH STUDIES; ROOM TEMPERATURE;

DESIGN; DROP FORMATION; ELECTROSTATIC FORCE; INDUSTRIAL RESEARCH; INK; RAPID PROTOTYPING;

SUBSTRATES;

EID: 78649850363     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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4. Gent, A.N. Lin, C.W., Model Studies of the effect of surface roughness and mechanical interlocking on adhesion. J. Adhesion and Technology, 1990. 32: p. 113-125.
5. "A Fast Flexible Ink-Jet Printing Method for Patterning Networks of Neurons in Culture", By Sawyer Buckminster Fuller, Final year thesis, Massachusetts Institute of Technology, September 2003.
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7. A. Rahman, J.B. Ko, K. Rehman, M.A. Ali Rehmani, Y.H. Doh, K.H. Choi "Study of Droplet Generation through Drop on Demand Electrostatic Inkjet for printed Electronics", at 1st International Conference on R2R Printed Electronics Apr 30-May 2, 2008 in Konkuk University, Seoul, Korea.