Solid-state interface reactions between silver and 95.5Sn-3.9Ag-0.6Cu and 63Sn-37Pb solders

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 38, Issue 10, 2007, Pages 2488-2502

  Vianco, Paul T ^a   Martin, Joseph J ^a   Wright, Robert D ^a   Hlava, Paul F ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

63SN37PB; AGING TEMPERATURES; F-PHASE; IMC LAYER; INTERFACE REACTIONS; KIRKENDALL EFFECTS; LAYER GROWTH; PHASE LAYERS; RATE KINETICS; SN-AG-CU; VOID FORMATION;

GROWTH KINETICS; KINETICS; LEAD; SILVER; STOICHIOMETRY;

TIN;

EID: 78649741491     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-007-9289-0     Document Type: Article

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