BCB wafer bonding compatible with bulk micro machining

Advances in Electronic Packaging

Volumn 1, Issue , 2003, Pages 93-99

  Popa, Dan O ^a   Kang, Byoung Hun ^a   Hwang, Tae Joo ^a   Lu, Jian Qiang ^a   Stephanou, Harry E ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

BCB wafer bonding; MEMS packaging; Microfluidic channels; Polymer bonding

Indexed keywords

ADHESIVES; BONDING; CURING; DRY ETCHING; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; REACTIVE ION ETCHING; SILICON NITRIDE; BUTENES; CHEMICAL STABILITY; COMPOSITE MICROMECHANICS; FLUIDIC DEVICES; MICROFLUIDICS; PACKAGING; POLYMERS; SILICON OXIDES; SILICON WAFERS;

BCB WAFER BONDING; MEMS PACKAGING; MICROFLUIDIC CHANNELS; POLYMER BONDING;

SILICON WAFERS; WAFER BONDING;

ADHESIVE LAYERS; ADHESIVE WAFER BONDING; BCB WAFER BONDING; BENZOCYCLOBUTENE; BOND STRENGTH; BONDING ADHESIVE; BULK MATERIALS; ELECTRICAL POTENTIAL; ETCH MASK; HARD MASKS; LOW PROCESSING TEMPERATURE; MEMS PACKAGING; MESA STRUCTURE; MICROELECTROMECHANICAL SYSTEMS; MICROFLUIDIC CHANNEL; MICROFLUIDIC CHANNELS; POLYMER BONDING; SPIN-COATING METHOD; THERMAL STABILITY; WAFER BONDING PROCESS; WAFER TO WAFER BONDING;

EID: 78649281888     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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