Manufacturing of electrically conductive microstructures by dropwise printing and laser curing of nanoparticle-suspensions

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 5, Issue , 2002, Pages 297-303

  Bieri, N R ^a   Haferl, S E ^a   Poulikakos, D ^a   Grigoropoulos, C P ^b  

^a SWISS FEDERAL INSTITUTE OF TECHNOLOGY   (Switzerland)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Laser curing; Microprinting; Nanoparticle suspensions

Indexed keywords

CURING; ELECTRIC CONDUCTIVITY; GOLD; INK JET PRINTING; IRRADIATION; MANUFACTURE; MECHANICAL ENGINEERING; MELTING POINT; NANOPARTICLES; ORGANIC SOLVENTS; SEMICONDUCTOR LASERS; SINTERING; SUBSTRATES; TOLUENE;

BULK COUNTERPART; CURVATURE EFFECT; ELECTRICAL CONDUCTIVITY; ELECTRICALLY CONDUCTIVE; EVAPORATION TEMPERATURE; FOCUSED LASER; GOLD PARTICLES; INK JET; LASER CURING; LASER IRRADIATIONS; LINE PATTERN; METAL NANOPARTICLES; MICRO DROPLETS; MICROCONDUCTORS; MICROPRINTING; NOVEL METHODS; SIZE RANGES; SMALL PARTICLES; SUSPENDED PARTICLES; THERMODYNAMIC ASPECTS; TOLUENE SOLVENT; ULTRAFINE PARTICLE;

SUSPENSIONS (FLUIDS);

EID: 78249284349     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2002-33859     Document Type: Conference Paper

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