Evaluation of toughness and hot/wet performance of epsilon resin system

International SAMPE Technical Conference

Volumn , Issue , 2008, Pages

  Li, Wei H ^a   Lehmann, Stan ^a  

^a HENKEL CORPORATION   (United States)

Author keywords

Characterization; Resins materials thermoset

Indexed keywords

AEROSPACE PRODUCTS; CHEMICAL STRUCTURE; CURE MECHANISMS; MECHANICAL PERFORMANCE; RESIN SYSTEMS; RESIN TECHNOLOGIES; RESINS/MATERIALS - THERMOSETS; STRUCTURAL ADHESIVE; STRUCTURAL COMPOSITES;

AEROSPACE APPLICATIONS; PRODUCT DEVELOPMENT; THERMOSETS;

RESINS;

EID: 78249247097     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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