Modeling and simulation of a parallel plate heat sink using computational fluid dynamics

International Journal of Advanced Manufacturing Technology

Volumn 51, Issue 1-4, 2010, Pages 415-419

  Arularasan, R ^b   Velraj, R ^a  

^a ANNA UNIVERSITY   (India)

^b NONE

Author keywords

ANOVA; CFD solver; Design of experiments; Heat sink; Thermal resistance

Indexed keywords

ANOVA; CFD SOLVER; COMMONLY USED; COMPUTATIONAL FLUID DYNAMICS PACKAGE; CONVECTIVE HEAT TRANSFER; DESKTOP COMPUTER; EFFECTIVE SURFACE AREA; ELECTRONICS COMPONENTS; ENHANCING HEAT TRANSFER; FAN POWER; FIN HEIGHT; FIN LENGTH; GEOMETRIC PARAMETER; HEAT DISSIPATION; HEAT SINK DESIGN; MODELING AND SIMULATION; OPERATING TEMPERATURE; PARALLEL PLATES; PERFORMANCE IMPROVEMENTS; RESPONSE GRAPHS; STABLE OPERATION; THERMAL RESISTANCE;

ANALYSIS OF VARIANCE (ANOVA); COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING SYSTEMS; DESIGN OF EXPERIMENTS; ENERGY EFFICIENCY; FINS (HEAT EXCHANGE); FLUID DYNAMICS; HEAT CONVECTION; MICROELECTRONICS; PERSONAL COMPUTERS; POWER ELECTRONICS; REGRESSION ANALYSIS;

HEAT RESISTANCE;

EID: 78149464539     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-008-1867-9     Document Type: Article

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