Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

2010 IEEE International Conference on Automation Science and Engineering, CASE 2010

Volumn , Issue , 2010, Pages 750-755

  Zhang, Tie Jun ^a   Wen, John T ^a   Peles, Yoav ^a   Tong, Tao ^b   Chang, Je Young ^c   Prasher, Ravi ^c   Jensen, Michael K ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b Arkansas Power Electronics International Inc   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE CONTROL; COOLING PERFORMANCE; DYNAMIC THERMAL MANAGEMENT; FLOW CONTROL METHODS; FLOW INSTABILITIES; MICRO ELECTRONICS COOLING; MICRO-SCALES; MICROCHANNEL COOLING; MICROCHANNEL SYSTEMS; MICROELECTRONIC SYSTEMS; OSCILLATORY FLOWS; POTENTIAL PROBLEMS; POWER DENSITIES; ULTRA-HIGH;

COOLING; ELECTRIC POWER SYSTEMS; MICROCHANNELS; MICROELECTRONICS; MULTIPHASE FLOW; TEMPERATURE CONTROL; THERMOELECTRIC EQUIPMENT; TRANSIENT ANALYSIS;

COOLING SYSTEMS;

EID: 78149428044     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/COASE.2010.5584171     Document Type: Conference Paper

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