Retrogression characteristics of a novel Al-Cu-Li-X alloy

International Journal of Minerals, Metallurgy and Materials

Volumn 17, Issue 5, 2010, Pages 624-628

  Yuan, Zhi Shan ^a,b   Lu, Zheng ^b   Wu, Xiu Liang ^b   Xie, You Hua ^b   Dai, Sheng Long ^b   Li, Chang Sheng ^c  

^a GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

^b BEIJING INSTITUTE OF AERONAUTICAL MATERIALS   (China)

^c NORTHEASTERN UNIVERSITY   (China)

Author keywords

aluminum lithium alloy; artificial aging; microstructure; retrogression

Indexed keywords

ALUMINUM LITHIUM ALLOY; ARTIFICIAL AGING; DARK FIELD IMAGES; EQUILIBRIUM PRECIPITATES; HIGHER TEMPERATURES; MATRIX; MICROSTRUCTURAL CHANGES; PEAK TEMPERATURES; RETROGRESSION; RETROGRESSION TREATMENT; SELECTED AREA ELECTRON DIFFRACTION; TEM;

ALUMINUM; ALUMINUM ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; DISSOLUTION; GRAIN BOUNDARIES; HARDNESS; HARDNESS TESTING; LITHIUM; MICROSTRUCTURE; TRANSMISSION ELECTRON MICROSCOPY;

LITHIUM ALLOYS;

EID: 78149424849     PISSN: 16744799     EISSN: 1869103X     Source Type: Journal    
DOI: 10.1007/s12613-010-0365-x     Document Type: Article

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