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Volumn 16, Issue 2, 2007, Pages 50-55
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Phase change materials for thermal management of IC packages
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Author keywords
FEM; Heat; Integrated circuit; Phase change
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Indexed keywords
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EID: 78149406197
PISSN: 12102512
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
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References (14)
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