Characterization of the damping behavior of a nanoindentation instrument for carrying out dynamic experiments

Proceedings of the Society for Experimental Mechanics, Inc.

Volumn 65, Issue , 2008, Pages 571-583

  Singh, S P ^a   Smith, J F ^b   Singh, R P ^c  

^a Stony Brook University   (United States)

^b MICRO MATERIALS LTD   (United Kingdom)

^c Oklahoma State University   (United States)

Author keywords

Dynamic indentation; Eddy current damping; Squeeze film damping

Indexed keywords

EID: 78149354449     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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