Elevated temperature deformation behavior of spark plasma sintered nanometric nickel with varied grain size distributions

Materials Science and Engineering: A

Volumn 528, Issue 2, 2010, Pages 663-671

  Holland, T B ^a   Ovid'ko, I A ^b   Wang, H ^c   Mukherjee, A K ^a  

^a University of California Davis   (United States)

^b INSTITUTE OF PROBLEMS OF MECHANICAL ENGINEERING   (Russian Federation)

^c Department of Electrical and Computer Engineering   (United States)

Author keywords

Bimodal; Creep; Deformation; Nanocrystalline; Nickel; Sintering

Indexed keywords

ACTIVATION ENERGY; CREEP; CREEP TESTING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; NANOCRYSTALS; NICKEL; SIZE DISTRIBUTION; STRAIN RATE;

ACTIVATION VOLUME; BIMODAL; DEFORMATION BEHAVIOR; ELEVATED TEMPERATURE DEFORMATION; FINE GRAINED; NANOCRYSTALLINES; NANOMETRICS; SPARK PLASMA; STRAIN-RATE SENSITIVITY; ULTRA-FINES;

SINTERING;

EID: 78049528064     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.09.044     Document Type: Article

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