Investigation and effects of wafer bow in 3D integration bonding schemes

Journal of Electronic Materials

Volumn 39, Issue 12, 2010, Pages 2605-2610

  Chen, K N ^a   Zhu, Y ^b   Wu, W W ^a   Reif, R ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c USA   (United States)

Author keywords

3D integration; wafer bonding; Wafer bow

Indexed keywords

3-D INTEGRATION; BONDING QUALITY; FABRICATION TECHNIQUE; LAYER TRANSFER; SILICON-ON-INSULATORS; THREE DIMENSIONAL (3D) INTEGRATION; WAFER BOW;

SEMICONDUCTING SILICON COMPOUNDS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 78049527087     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1341-y     Document Type: Conference Paper

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