Evaluation and application of resist for alkaline wet etching

IEEJ Transactions on Sensors and Micromachines

Volumn 130, Issue 9, 2010, Pages 421-425

  Takahashi, Tomokazu ^a   Makihata, Mitsutoshi ^a   Esashi, Masayoshi ^a   Tanaka, Shuji ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Alkaline wet etching; Low temperature process; Resist; Side etching

Indexed keywords

LIGHT SENSITIVE MATERIALS; PHOTOSENSITIVITY; TEMPERATURE;

ALKALINE ETCHING; LOW TEMPERATURES; LOW- TEMPERATURE PROCESS; LOW-TEMPERATURE OXIDES; REAL APPLICATIONS; REMOVAL CHARACTERISTICS; RESIST; SIDE ETCHING;

WET ETCHING;

EID: 78049450472     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.130.421     Document Type: Article

References (3)

1. US Patent 20080261145 A1 (Oct. 23, 2008)
2. J. Dalvi-Malhotra, X. F. Zhong, C. Planje, G Brand, and K. Yess : "A spin-on photosensitive polymeric etch protection mask for aniotropic wet etching of silicon", J. Micromech. Microeng., Vol.18, No.2, 25029 (2008)