Preparation and characterization of silica/polyamide-imide nanocomposite thin films

Nanoscale Research Letters

Volumn 5, Issue 11, 2010, Pages 1846-1851

  Ma, Xiaokun ^a   Lee, Nam Hee ^a   Oh, Hyo Jin ^a   Hwang, Jong Sun ^b   Kim, Sun Jae ^a  

^a Sejong University   (South Korea)

^b Jeonnam Provincial College   (South Korea)

Author keywords

Composites; Fracture; Surfaces; Thermal properties; Thin films

Indexed keywords

CETYLTRIMETHYLAMMONIUM BROMIDE; COEFFICIENTS OF THERMAL EXPANSIONS; COMPOSITES; ENAMEL WIRES; HIGH THERMAL STABILITY; LOW COEFFICIENT OF THERMAL EXPANSIONS; MATRIX; MODIFIED SILICA; NANOCOMPOSITE FILM; NANOCOMPOSITE THIN FILMS; SCANNING ELECTRON MICROSCOPES; SILICA NANOPARTICLES; SILICA PARTICLES; THERMAL PROPERTIES; THERMOMECHANICAL ANALYSIS; WELL-DISPERSED;

AMMONIUM COMPOUNDS; BLENDING; BROMINE COMPOUNDS; CATIONIC SURFACTANTS; COMPOSITE FILMS; DYES; FRACTURE; NANOCOMPOSITES; NANOPARTICLES; POLYAMIDEIMIDES; SCANNING ELECTRON MICROSCOPY; SILICA; THERMAL EXPANSION; THERMAL STRESS; THERMOGRAVIMETRIC ANALYSIS; THIN FILMS; VAPOR DEPOSITION;

FILM PREPARATION;

EID: 78049428459     PISSN: 19317573     EISSN: 1556276X     Source Type: Journal    
DOI: 10.1007/s11671-010-9726-7     Document Type: Article

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