Through hole plating of printed circuit boards using ultrasonically dispersed copper nanoparticles

Circuit World

Volumn 36, Issue 3, 2010, Pages 9-13

  Cobley, A J ^a   Comeskey, D J ^a   Paniwnyk, L ^a   Mason, T J ^a  

^a Institute for Clean Growth and Future Mobility   (United Kingdom)

Author keywords

Copper; Electroplating; Nanotechnology; Printed circuits

Indexed keywords

CATALYSE; CATALYTIC MATERIALS; CONDUCTIVE LAYER; COPPER NANOPARTICLES; DESIGN/METHODOLOGY/APPROACH; DIRECT-PLATE PROCESS; ELECTROLESS COPPER; ELECTROLESS COPPER DEPOSITION; ELECTROLESS COPPER PLATING; ELECTROPLATED DEPOSITS; FUNCTIONALIZED; MAGNETIC STIRRERS; MECHANICAL AGITATION; OPTICAL MICROSCOPES; PROOF OF CONCEPT; THROUGH HOLE; THROUGH-HOLE PLATING;

COPPER; COPPER PLATING; DEPOSITS; DISPERSIONS; ELECTROPLATING; HOLE CONCENTRATION; METAL FINISHING; NANOMAGNETICS; NANOPARTICLES; PALLADIUM; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SCANNING ELECTRON MICROSCOPY; ULTRASONIC APPLICATIONS; ULTRASONICS;

COPPER DEPOSITS;

EID: 78049373796     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056121011066288     Document Type: Article

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