Effects of acetonitrile on electrodeposition of Ni from a hydrophobic ionic liquid

Electrochimica Acta

Volumn 55, Issue 28, 2010, Pages 9019-9023

  Zhu, Yan Li ^a   Katayama, Yasushi ^a   Miura, Takashi ^a  

^a KEIO UNIVERSITY   (Japan)

Author keywords

1 butyl 1 methylpyrrolidinium; Acetonitrile; Bis(trifluoromethylsulfonyl)amide; Electrodeposition; Ionic liquid; Nickel

Indexed keywords

1-BUTYL-1- METHYLPYRROLIDINIUM; BIS(TRIFLUOROMETHYLSULFONYL)AMIDE; COORDINATION ENVIRONMENT; DIFFUSION COEFFICIENTS; ELECTRODE SURFACES; FT-IR SPECTRUM; HYDROPHOBIC IONIC LIQUID; REDUCTION POTENTIAL; ROOM TEMPERATURE IONIC LIQUIDS; SEM;

ACETONITRILE; AMIDES; ELECTRODEPOSITION; HYDROPHOBICITY; IONS; NICKEL;

IONIC LIQUIDS;

EID: 78049267676     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2010.07.097     Document Type: Article

References (32)

1. D. Landolt J. Electroanal. Chem. 149 2002 S9
2. R.O. Kova, A. Turonova, D. Kladekova, M. Galova, and R.M. Smith J. Appl. Electrochem. 36 2006 957
3. D. Golodnitsky, Y. Rosenberg, and A. Ulus Electrochim. Acta 47 2002 2707
4. A. Ciszewski, S. Posluszny, G. Milczarek, and M. Baraniak Surf. Coat. Technol. 183 2004 127
5. K.M. Yin J. Electrochem. Soc. 144 1997 1560
6. A.C. Mishra, A.K. Thakur, and V. Srinivas J. Mater. Sci. 44 2009 3520
7. K.R. Marikkannu, G.P. Kalaignan, and T. Vasudevan J. Alloys Compd. 438 2007 332
8. Y. Katayama, R. Fukui, and T. Miura J. Electrochem. Soc. 154 2007 D534
9. E.B. Sauhestre Plating 1958 1119
10. C.C. Roth, and H. Leidheiser J. Electrochem. Soc. 100 1953 553
11. M. Troyon, and L. Wang Appl. Surf. Sci. 103 1996 517
12. L. Oniciu, and L. Muresan J. Appl. Electrochem. 21 1991 565
13. T. Mimani, and S.M. Mayanna J. Appl. Electrochem. 23 1993 339
14. N. Kaneko, N. Shinohara, Y. Itoh, and H. Nezu Bunseki Kagaku 40 1991 655
15. Y. Nakamura, N. Kaneko, M. Watanabe, and H. Nezu J. Appl. Electrochem. 24 1994 227
16. G.T. Rogers, and M.J. Ware J. Electrochem. Soc. 107 1960 677
17. A. Bhandari, S.J. Hearne, B.W. Sheldon, and S.K. Soni J. Electrochem. Soc. 156 2009 D279
18. T.A. Costavaras, M. Froment, and A.H. Goff J. Electrochem. Soc. 120 1973 867
19. A.P. Abbott, K.E. Ttaib, K.S. Ryder, and E.L. Smith Trans. Inst. Met. Finish. 86 2008 234
20. P.X. Yang, M.Z. An, C.N. Su, and F.P. Wang Chin. J. Inorg. Chem. 25 2009 112
21. J. Ding, J. Wu, D. MacFarlane, W.E. Price, and G. Wallace Electrochem. Commun. 10 2008 217
22. Y.-L. Zhu, Y. Kozuma, Y. Katayama, and T. Miura Electrochim. Acta 54 2009 7502
23. K. Fujii, T. Nonaka, Y. Akimoto, Y. Umebayashi, and S. Ishiguro Anal. Sci. 24 2008 1377
24. M. Yamagata, Y. Katayama, and T. Miura J. Electrochem. Soc. 153 2006 E5
25. B.N. Figgis Introduction to Ligand Fields 1966 John Wiley and Sons New York, London (Chapter 9)
26. J.J. Banewicz, J.A. Maguire, M.E. Munnell, and M.L. Moore Thermochim. Acta 12 1975 377
27. M. Herstedt, M. Smirnov, P. Johansson, M. Chami, J. Grondin, L. Servant, and J.C. Lassegues J. Raman Spectrosc. 36 2005 762
28. P. Johansson, S.P. Gejji, J. Tegenfeldt, and J. Lindgren Electrochim. Acta 43 1998 1375
29. T.C. Franklin Surf. Coat. Technol. 30 1987 415
30. A.J. Bard, and L.R. Faulkner Electrochemical Methods, Fundamentals and Applications 2nd ed. 2001 John Wiley and Sons, Inc. New York
31. J. Jacquemin, P. Husson, V. Mayer, and I. Cibulka J. Chem. Eng. Data 52 2007 2204
32. B. Scharifker, and G. Hills Electrochim. Acta 28 1983 879