Mechanical and transport properties of low-temperature negative thermal expansion material Mn3CuN co-doped with Ge and Si

Cryogenics

Volumn 50, Issue 11-12, 2010, Pages 750-753

  Huang, Rongjin ^a   Wu, Zhixiong ^a,b   Yang, Huihui ^a,b   Chen, Zhen ^a,b   Chu, Xinxin ^a,b   Li, Laifeng ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

A. Ceramics; C. Electrical resistivity; C. Mechanical properties; C. Thermal conductivity; C. Thermal expansion

Indexed keywords

A. CERAMICS; C. MECHANICAL PROPERTIES; C. THERMAL CONDUCTIVITY; C. THERMAL EXPANSION; ELECTRICAL RESISTIVITY;

BUOYANCY; CARBON FIBER REINFORCED PLASTICS; CERAMIC MATERIALS; COMPRESSION TESTING; COMPRESSIVE STRENGTH; CRYOGENICS; ELECTRIC CONDUCTIVITY; GERMANIUM; MANGANESE; MANGANESE COMPOUNDS; MECHANICAL PROPERTIES; NITRIDES; PEROVSKITE; SILICON; SINTERING; THERMAL CONDUCTIVITY; THERMAL STRESS; THERMOANALYSIS;

THERMAL EXPANSION;

EID: 78049239964     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cryogenics.2010.09.001     Document Type: Article

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