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Volumn 114, Issue 42, 2010, Pages 18091-18095

Thermally activated interlayer bonding in multiwalled carbon nanotubes

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE APPLICATION; FIRST-PRINCIPLES CALCULATION; HIGH TEMPERATURE; HIGH-TEMPERATURE TENSILE; INTERLAYER BONDING; INTERLAYER BONDS; LOAD CARRYING CAPACITIES; MECHANICAL AND ELECTRONIC PROPERTIES; MOLECULAR DYNAMICS SIMULATIONS; THEORETICAL RESULT; THERMAL ENGINEERING; THERMAL TREATMENT; THERMALLY ACTIVATED;

EID: 77958588969     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp106444n     Document Type: Article
Times cited : (13)

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