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Proceedings of the 2010 IEEE International Conference on Solid Dielectrics, ICSD 2010

Volumn , Issue , 2010, Pages

Space charge behaviour on epoxy based dielectrics filled with micro and nano silica

(7) Castellon, J a Agnel, S a Toureille, A a Frechette M F b Savoie, S b Krivda, A c Schmidt, L E c

a UNIV MONTPELLIER (France)

b HYDRO QUÉBEC (Canada)

c ABB SWITZERLAND LTD (Switzerland)

Author keywords

Dielectric spectroscopy; Electric field; Nanodielectrics; Space charge; Thermal Step Method; Transmission Electron Microscopy

Indexed keywords

COMPARATIVE STUDIES; DIELECTRIC BEHAVIOUR; FILLER DISTRIBUTION; NANO SILICA; NANO-FILLERS; NANODIELECTRICS; NANOMETRICS; NANOSTRUCTURED MORPHOLOGY; POLARIZABILITIES; SILICA FILLER; SPACE CHARGES; SPACE-CHARGE ACCUMULATION; TEM; THERMAL POLING; THERMAL STEP METHOD; TRANSMISSION ELECTRON;

DIELECTRIC DEVICES; DIELECTRIC SPECTROSCOPY; ELECTRIC FIELD EFFECTS; ELECTRIC SPACE CHARGE; FILLERS; SILICA; TRANSMISSION ELECTRON MICROSCOPY;

DIELECTRIC MATERIALS;

EID: 77958053687 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ICSD.2010.5568043 Document Type: Conference Paper

Times cited : (8)

References (5)

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2
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- Review of Space Charge Measurements in Dielectrics
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- Ahmed, N.H.¹ Srinivas, N.N.²

3
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- Détermination des charges d'espace dans les isolants solides par la méthode de l'onde thermique
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4
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- Deter-mination of electric field and space charge in the insulation of power cables with the thermal step method and a new mathe-matical processing
- P. Notingher jr, A. Toureille, S. Agnel and J. Castellon, "Deter-mination of electric field and space charge in the insulation of power cables with the thermal step method and a new mathe-matical processing", IEEE Trans. on Industry Appl., Vol. 45, No. 1, pp. 67-74 (2009).
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5
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- Space Charge Characterization of multi-stressed microcomposite nano-filled epoxy for Electrotechnical Applications
- J. Castellon, S. Agnel, A. Toureille, M. Fréchette, "Space Charge Characterization of multi-stressed microcomposite nano-filled epoxy for Electrotechnical Applications", CEIDP 2008, Quebec City, CA, pp. 532-535 (2008).
- (2008) CEIDP 2008, Quebec City, CA , pp. 532-535
- Castellon, J.¹ Agnel, S.² Toureille, A.³ Fréchette, M.⁴

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