Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED)

European Solid-State Device Research Conference

Volumn , Issue , 1997, Pages 496-499

  Kohári, Zs ^a   Szekely, V ^a   Rencz, M ^a   Dudek, V ^b   Hofflinger, B ^b  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b Institut fur Mikroelektronik Stuttgart   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

LEAKAGE CURRENTS; SILICON;

ELEMENT DENSITY; HEAT REMOVAL; HEAT TRANSFER PROPERTIES; HIGH SPEED; SELF-HEATING; SILICON ON INSULATOR STRUCTURES; SOI CIRCUITS; SOI STRUCTURE;

SILICON OXIDES;

EID: 77957906878     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDERC.1997.194474     Document Type: Conference Paper

References (3)

1. V. Dudek, V.O. Keck, G. Mayer, B. Höfflinger: "Design considerations for high-performance low-power Silicon-on-insulator, gate arrays", Custom Integrated Circuits Conference 1995, Santa Clara, CA, May 1995
2. V. Székely: SUNRED: a new thermal simulator and typical applications, THERMINIC Workshop97 Cannes, France, accepted for publication
3. SYSTUS Users manual Rev. B, Framasoft+CSI, 1994.