Through-silicon-via technology for 3D integration

2010 IEEE International Memory Workshop, IMW 2010

Volumn , Issue , 2010, Pages

  Dukovic, J ^a   Ramaswami, S ^a   Pamarthy, S ^a   Yalamanchili, R ^a   Rajagopalan, N ^a   Sapre, K ^a   Cao, Z ^a   Ritzdorf, T ^a   Wang, Y ^a   Eaton, B ^a   Ding, R ^a   Hernandez, M ^a   Naik, M ^a   Mao, D ^a   Tseng, J ^a   Cui, D ^a   Mori, G ^a   Fulmer, P ^a   Sirajuddin, K ^a   Hua, J ^a   Xia, S ^a   Erickson, D ^a   Beica, R ^a   Young, E ^a   Kusler, P ^a   Kulzer, R ^a   Oemardani, S ^a   Dai, H ^a   Xu, X ^a   Okazaki, M ^a   Dotan, K ^a   Yu, C ^a   Lazik, C ^a   Tran, J ^a   Luo, L ^a   more..

^a APPLIED MATERIALS INC   (United States)

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EID: 77957896755     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMW.2010.5488399     Document Type: Conference Paper

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