|
Volumn , Issue , 2010, Pages
|
Thermal conductivity of reinforced composites for electrical applications
|
Author keywords
[No Author keywords available]
|
Indexed keywords
DIELECTRIC DISSIPATION FACTORS;
ELECTRICAL APPLICATIONS;
ELECTRICAL INSULATION;
ELECTRICAL PROPERTY;
FIBER REINFORCED COMPOSITES;
FILLER MATERIALS;
FLEXURAL STRENGTH;
MATRIX;
REINFORCED COMPOSITES;
REINFORCED EPOXY;
SUBMICRON;
THERMAL MANAGEMENT;
THERMAL PROPERTIES;
ASPECT RATIO;
DIELECTRIC PROPERTIES OF SOLIDS;
FILLERS;
HEAT RESISTANCE;
MECHANICAL PROPERTIES;
TECHNICAL PRESENTATIONS;
THERMAL CONDUCTIVITY;
THERMAL INSULATION;
THERMOANALYSIS;
ELECTRIC PROPERTIES;
|
EID: 77957343160
PISSN: 01642006
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ELINSL.2010.5549716 Document Type: Conference Paper |
Times cited : (6)
|
References (4)
|