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Volumn 53, Issue 25-26, 2010, Pages 5988-5995

Thermal optimization of plate-fin heat sinks with variable fin thickness

Author keywords

Heat sink; Thermal optimization; Variable fin thickness

Indexed keywords

FIN THICKNESS; FLUID FLOW; PLATE-FIN HEAT SINK; PUMPING POWER; THERMAL OPTIMIZATION; THERMAL RESISTANCE; VOLUME AVERAGING THEORY;

EID: 77957313566     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2010.07.052     Document Type: Article
Times cited : (56)

References (7)
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    • A. Bar-Cohen, Thermal management of electric components with dielectric liquids, in: J.R. Lloyd, Y. Kurosaki (Eds.), Proceedings of ASME/JSME Thermal Engineering Joint Conference, vol. 2, 1996, pp. 15-39.
    • (1996) Proceedings of ASME/JSME Thermal Engineering Joint Conference , vol.2 , pp. 15-39
    • Bar-Cohen, A.1
  • 2
    • 85008571330 scopus 로고
    • Thermal management of electronic equipment: A review of technology and research topics
    • W. Nakayama Thermal management of electronic equipment: a review of technology and research topics Appl. Mech. Rev. 39 12 1986 1847 1868
    • (1986) Appl. Mech. Rev. , vol.39 , Issue.12 , pp. 1847-1868
    • Nakayama, W.1
  • 4
    • 0037030148 scopus 로고    scopus 로고
    • Numerical optimization of the thermal performance of a microchannel heat sink
    • J.H. Ryu, S.J. Kim, and D.H. Choi Numerical optimization of the thermal performance of a microchannel heat sink Int. J. Heat Mass Transfer 45 2002 2823 2827
    • (2002) Int. J. Heat Mass Transfer , vol.45 , pp. 2823-2827
    • Ryu, J.H.1    Kim, S.J.2    Choi, D.H.3
  • 5
    • 36549033379 scopus 로고    scopus 로고
    • Closed-form correlations for thermal optimization of microchannels
    • S.J. Kim, and D. Kim Closed-form correlations for thermal optimization of microchannels Int. J. Heat Mass Transfer 50 2007 5318 5322
    • (2007) Int. J. Heat Mass Transfer , vol.50 , pp. 5318-5322
    • Kim, S.J.1    Kim, D.2
  • 6
    • 0028400636 scopus 로고
    • Plate fins with variable thickness and height for air-cooled electronic modules
    • M. Morega, and A. Bejan Plate fins with variable thickness and height for air-cooled electronic modules Int. J. Heat Mass Transfer 37 1994 433 445
    • (1994) Int. J. Heat Mass Transfer , vol.37 , pp. 433-445
    • Morega, M.1    Bejan, A.2
  • 7
    • 0000901517 scopus 로고
    • Laminar flow friction and forced convection heat transfer in ducts of arbitrary geometry
    • R.K. Shah Laminar flow friction and forced convection heat transfer in ducts of arbitrary geometry Int. J. Heat Mass Transfer 18 1975 849 862
    • (1975) Int. J. Heat Mass Transfer , vol.18 , pp. 849-862
    • Shah, R.K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.