Concentration effect of copper loading on the reductive dechlorination of tetrachloroethylene by zerovalent silicon

Water Science and Technology

Volumn 62, Issue 1, 2010, Pages 28-35

  Lee, Chun Chi ^a   Doong, Ruey An ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Bimetallic Cu Si system; Copper ion; Reductive dechlorination; Surface coverage; Zerovalent silicon

Indexed keywords

BIMETALLIC CU/SI SYSTEM; COPPER ION; REDUCTIVE DECHLORINATION; SURFACE COVERAGE; ZEROVALENT;

AGGLOMERATION; CONCENTRATION (PROCESS); COPPER; ELECTRON PROBE MICROANALYSIS; LOADING; METAL IONS; RATE CONSTANTS; SILICON; X RAY PHOTOELECTRON SPECTROSCOPY;

DECHLORINATION;

COPPER ION; SILICON; TETRACHLOROETHYLENE; WATER; COPPER;

ANOXIC CONDITIONS; CONCENTRATION (COMPOSITION); COPPER; DECHLORINATION; ELECTRON PROBE ANALYSIS; REDUCTION; SILICON; TETRACHLOROETHYLENE; X-RAY SPECTROSCOPY;

ARTICLE; CHEMICAL ANALYSIS; CHEMICAL REACTION; CONCENTRATION RESPONSE; CONTROLLED STUDY; CRYSTALLOGRAPHY; DECHLORINATION; ELECTRON PROBE MICROANALYSIS; INCUBATION TIME; REDUCTION KINETICS; X RAY PHOTOELECTRON SPECTROSCOPY; CHEMISTRY; WATER POLLUTANT;

KOBUS;

COPPER; SILICON; TETRACHLOROETHYLENE; WATER POLLUTANTS, CHEMICAL;

EID: 77957282467     PISSN: 02731223     EISSN: None     Source Type: Journal    
DOI: 10.2166/wst.2010.236     Document Type: Article

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