Thermal Control of Electronic Equipment and Devices

Advances in Heat Transfer

Volumn 20, Issue C, 1990, Pages 181-314

  Peterson, G P ^a   Ortega, Alfonso ^b  

^a TEXAS A AND M UNIVERSITY   (United States)

^b UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 77957099804     PISSN: 00652717     EISSN: None     Source Type: Book Series    
DOI: 10.1016/S0065-2717(08)70028-5     Document Type: Article

References (325)

1. Otani, S., Tanaka, O., High power semiconductor rectifier equipment using boiling and condensing heat transfer. Proc. IAS Conf., 10th, 1975, 46–52.
2. EPP Staff Report. Considerations in device cooling. Electron. Packag. Prod. 21 (1981), 304–311.
3. Nelson, L.A., Sekhon, K.S., Fritz, J.E., Direct heat pipe cooling of semiconductor devices. Proc. Int. Heat Pipe Conf., 3rd, 1978, 373–376.
4. J. S. Goodling, R. C. Jaeger, N. V. Williamson, C. D. Ellis, and T. D. Slagh, Wafer scale cooling using jet impingement boiling heat transfer. ASME Pap. No. 87-WA/EEP-3(1987).
5. Biskeborn, R.G., Horvath, J.L., Hultmark, E.B., Integral cap heat sink assembly for the IBM 4381 processor. Proc. Int. Electron. Packag. Soc. Conf., 4th, 1984, 468–474.
6. Okutani, K., Otsuka, K., Sahara, K., Satoh, K., Packaging design of a SiC ceramic multichip RAM module. Proc. Int. Electron. Packag. Soc. Conf., 4th, 1984, 299–304.
7. Kohara, M., Nakao, S., Tsutsumi, K., Shibata, H., Nakata, H., High thermal conduction module. Proc. IEEE Electr. Components Conf., 1985, 180–186.
8. Danielson, R.D., Krajewski, N., Brost, J., Cooling a superfast computer. Electron. Packag. Prod. 26 (1986), 44–45.
9. Moran, K., Oktay, S., Cooling concepts for IBM electronic packages. Proc. Annu. Int. Electron. Packag. Soc. Conf., 2nd, 1982, 120–140.
10. Chu, R.C., Hwang, U.P., Simons, R.E., Conduction cooling for an LSI package: A one-dimensional approach. IBM J. Res. Dev. 26 (1982), 45–54.
11. Watari, T., Murano, H., Packaging technology for the NEC SX supercomputer. Proc. IEEE Electron. Components Conf., 1985, 192–198.
12. Wayner, P.C. Jr., Parks, J.C., Effect of liquid composition on enhanced flow due to surface shear in the contact line region: Constant vapor pressure boundary condition. Heat Transfer in Electronic Equipment,” ASME HTD-57, 1985, ASME, New York, 57–63.
13. Mudawwar, I., Incropera, T.A., Incropera, F.P., Microelectronic cooling by fluorocarbon liquid films. Proc. Int. Symp. Cool. Technol. Electron. Equip., 1987, 340–358.
14. Incropera, F.P., Research needs in electronic cooling. Proc. Res. Needs Electron. Cool, 1986, Workshop sponsored by Nat. Sci. Found, and Purdue Univ., Lafayette, Indiana.
15. Hannemann, R., Electronic systems thermal management: An overview. Winer, W.O., et al. (eds.) Research Needs in Thermal Systems, 1986, ASME, New York, 167–181.
16. Chu, R.C., Heat transfer in electronic systems. Tien, C.L., et al. (eds.) Heat Transfer 1986, 1986, Hemisphere, New York, 293–304.
17. Oktay, S., Bar-Cohen, A., Hannemann, R., High heat from a small package. Mech. Eng. 108 (1986), 36–42.
18. Aihara, T., Effects of inlet boundary condition on numerical solutions of free convection between vertical parallel plates. Rep. Inst. High-Speed Mech., Tohoku Univ. 28 (1973), 1–27.
19. Aihara, T., Laminar free convective heat transfer in vertical uniform heat flux ducts (numerical solutions with constant/temperature-dependent fluid properties. Heat Transfer–Jpn. Res. 15 (1986), 69–86.
20. Aung, W., Fully developed laminar free convection between vertical flat plates heated asymmetrically. Int. J. Heat Mass Transfer 15 (1972), 1577–1580.
21. Aung, W., Heat transfer in electronic systems with emphasis on asymmetric heating. Bell Syst. Tech. J. 52 (1973), 907–925.
22. Aung, W., Fletcher, L.S., Sernas, V., Developing laminar free convection between vertical flat plates with asymmetric heating. Int. J. Heat Mass Transfer 15 (1972), 2293–2307.
23. Aung, W., Chimah, B., Laminar heat exchange in vertical channels–application to cooling of electronic systems. Kakac, S., et al. (eds.) Low Reynolds Number Flow Heat Exchangers, 1981, Hemisphere, New York, 395–413.
24. Bodoia, J.R., Osterle, J.F., The development of free convection between heated vertical plates. J. Heat Transfer 84 (1962), 40–44.
25. Churchill, S.W., A comprehensive correlating equation for buoyancy induced flow in channels. Lett. Heat Mass Transfer 4 (1977), 193–200.
26. Currie, I.G., Newman, W.A., Natural convection between isothermal vertical surfaces. Int. Heat Transfer Conf. Proc., 1970 4th Pap. No. NC-2–7.
27. Dalbert, A.M., Penot, F., Peube, J.L., Convection naturelle laminaire dans un canal vertical chauffe a flux constant. Int. J. Heat Mass Transfer 24 (1981), 1463–1473.
28. Dalbert, A.M., Natural, mixed and forced convection in a vertical channel with asymmetric uniform heating. Proc. Int. Heat Transfer Conf., 7th 3 (1982), 431–434.
29. Davis, L.P., Perona, J.P., Development of free convective flow of a gas in a heated vertical open tube. Int. J. Heat Mass Transfer 14 (1971), 889–903.
30. Dyer, J.R., The development of laminar natural convective flow in a vertical uniform heat flux duct. Int. J. Heat Mass Transfer 18 (1975), 1455–1465.
31. Dyer, J.R., Natural convection flow through a vertical duct with a restricted entry. Int. J. Heat Mass Transfer 21 (1978), 1341–1354.
32. Elenbaas, W., Heat dissipation of parallel plates by free convection. Physica (Amsterdam 9 (1942), 1–28.
33. R. K. Engel and W. K. Mueller, An analytical investigation of natural convection in vertical channels. ASME Pap. No. 67-HT-16 1967.
34. R. K. Engel, The development of natural convection on vertical flat plates and in vertical channels. Ph. D. Thesis, Sch. Eng. Sci., New York University, New York, 1965.
35. Greif, R., An experimental and theoretical study of heat transfer in vertical tube flows. J. Heat Transfer 100 (1978), 86–91.
36. Hetherington, H.J., Patten, T.D., Laminar flow natural convection from the open vertical cylinder with uniform heat flux at the wall. Int. J. Heat Mass Transfer 19 (1976), 1121–1125.
37. Jackson, T.W., Harrison, W.B., Boteler, W.C., Combined free and forced convection in a constant-temperature vertical tube. J. Heat Transfer 80 (1958), 739–745.
38. Kettleborough, C.F., Transient laminar free convection between heated vertical plates including entrance effects. Int. J. Heat Mass Transfer 15 (1972), 883–896.
39. Lauber, T.S., Welch, A.U., Natural convection heat transfer between vertical flat plates with uniform heat flux. Proc. Int. Heat Transfer Conf. 3rd, Chicago, Ill., 1966, 126–131.
40. T. S. Lee, Natural convection in a vertical channel with heat and mass transfer and flow reversal. Ph. D. Thesis, Dep. Aeronaut. Astronaut., Stanford University, Stanford, California, 1979.
41. Marner, W.J., McMillan, H.K., Combined free and forced laminar convection in a vertical tube with constant wall temperature. J. Heat Transfer 92 (1970), 559–562.
42. Meric, R.A., An analytical study of natural convection in a vertical open tube. Int. J. Heat Mass Transfer 20 (1977), 429–431.
43. Miyatake, O., Fujii, T., Free convective heat transfer between vertical plates–one plate isothermally heated and the other thermally insulated. Heat Transfer–Jpn. Res. 1 (1972), 30–38.
44. Miyatake, O., Fujii, T., Natural convection heat transfer between vertical parallel plates at unequal uniform temperatures. Heat Transfer–Jpn. Res. 2 (1973), 79–88.
45. Miyatake, O., Fujii, T., Natural convective heat transfer between vertical parallel plates with unequal heat fluxes. Heat Transfer–Jpn. Res. 3 (1974), 29–33.
46. Miyatake, O., Fujii, T., Fujii, M., Tanaka, H., Natural convective heat transfer between vertical parallel plates–one plate with a uniform heat flux and the other thermally insulated. Heat Transfer–Jpn. Res. 2 (1973), 25–33.
47. Morton, B.R., Laminar convection in uniformly heated vertical pipes. J. Fluid Mech. 8 (1960), 227–240.
48. Nakamura, H., Asako, Y., Naitou, T., Heat transfer by free convection between two parallel flat plates. Numer. Heat Transfer 5 (1982), 95–106.
49. Ofi, O., Hetherington, H.J., Application of the finite element method to natural convection heat transfer from the open vertical channel. Int. J. Heat Mass Transfer 20 (1977), 1195–1204.
50. S. J. Ormiston, G. D. Raithby, and K. G. T. Hollands, Numerical predictions of natural convection in a Trombe wall system. ASME Pap. No. 85–HT-36(1985).
51. S. Ostrach, Laminar natural convection flow and heat transfer of fluids with and without heat sources in channels with constant wall temperatures. NACA Tech. Note No. 2863(1952).
52. S. Ostrach, Combined natural and forced convection laminar flow and heat transfer of fluids with and without heat sources in channels with linearly varying wall temperatures. NACA Tech. Note No. 3141(1954).
53. Quintiere, J.G., Mueller, W.K., An analysis of laminar free and forced convection between finite vertical parallel plates. J. Heat Transfer 95 (1973), 53–59.
54. S. D. Savkar, Developing forced and free convective flows between two semi-infinite parallel plates. Proc. Int. Heat Transfer Conf., 4th Pap. No. NC-3.8(1970).
55. Sparrow, E.M., Azevedo, L.F.A., Vertical channel natural convection spanning the fully-developed limit and the single-plate boundary layer limit. Int. J. Heat Mass Transfer 28 (1985), 1847–1857.
56. Sparrow, E.M., Bahrami, P.A., Experiments on natural convection from vertical parallel plates with either open or closed edges. J. Heat Transfer 102 (1980), 221–227.
57. Sparrow, E.M., Chrysler, G.M., Azevedo, L.F., Observed flow reversals and measured-predicted Nusselt numbers for natural convection in a one-sided heated vertical channel. J. Heat Transfer 106 (1984), 325–332.
58. Tao, L.N., On combined free and forced convection in channels. J. Heat Transfer 82 (1960), 233–238.
59. R. A. Wirtz and R. J. Stutzman, Experiments on free convection between vertical plates with symmetric heating J. Heat Transfer 104 501–507.
60. Yao, L.S., Free and forced convection in the entry region of a heated vertical channel. Int. J. Heat Mass Transfer 26 (1983), 65–72.
61. W. Aung, T. J. Kessler, and K. I. Beitin, Natural convection cooling of electronic cabinets containing arrays of vertical circuit cards. ASME Pap. No. 72-WA/HT-40(1972).
62. Aung, W., Kessler, T.J., Beitin, K.I., Free convection cooling of electrronic systems. IEEE Trans. Parts, Hybrids, Packag. PHP-9 (1973), 75–86.
63. Johnson, C.E., Evaluation of correlations for natural convection cooling of electronic equipment. Fundamentals of Natural Convection/Electronic Equipment Cooling, 1984, ASME, New York, 103–111 ASME HTD-32.
64. Birnbreier, H., Experimental investigations on the temperature rise of printed circuit boards in open cabinets with natural ventilation. Heat Transfer in Electronic Equipment, 1981, ASME, New York, 19–23 ASME HTD-20.
65. Coyne, J.C., An analysis of circuit board temperatures in electronic equipment frames cooled by natural convection. Fundamentals of Natural Convection/Electronic Equipment Cooling, 1984, ASME, New York, 59–65 ASME HTD-32.
66. Ishizuka, M., Miyazaki, Y., Sasaki, T., On the cooling of natural air-cooled electronic equipment casings–proposal of a practical formula for thermal design. JSME Bull. 29 (1984), 119–123.
67. M. Ishizuka, Y. Miyazaki, and T. Sasaki, Aerodynamic resistance for perforated plates and wire nettings in natural convection. ASME Pap. No. 84-WA/HT-87(1986).
68. Tierney, J.K., Koczkur, E., Free convection heat transfer from a totally enclosed cabinet containing simulated electronic equipment. IEEE Trans. Parts, Hybrids, Packag. PHP-7 (1971), 115–123.
69. Noronha, R.I., Free convective cooling of cabinets containing heat-dissipating components. Proc. Inst. Mech. Eng. 179 (1964), 439–450.
70. Sparrow, E.M., Faghri, M., Natural convection heat transfer from the upper plate of a co-linear, separated pair of vertical plates. J. Heat Transfer 102 (1980), 623–629.
71. Sparrow, E.M., Prakash, C., Enhancement of natural convection heat transfer by a staggered array of discrete vertical plates. J. Heat Transfer 102 (1980), 215–220.
72. Prakash, C., Sparrow, E.M., Natural convection heat transfer performance evaluations for discrete (in-line or staggered) and continuous plate arrays. Numer. Heat Transfer 3 (1980), 89–105.
73. Sobel, N., Landis, F., Mueller, W.W., Natural convection heat transfer in short vertical channels including the effects of stagger. Proc. Int. Heat Transfer Conf., 3rd 4 (1966), 121–125.
74. Sparrow, E.M., Shah, S., Prakash, C., Natural convection in a vertical channel: 1. Interacting convection and radiation; 2. The vertical plate with and without shrouding. Numer. Heat Transfer 3 (1980), 297–314.
75. Carpenter, J.R., Briggs, D.G., Sernas, V., Combined radiation and developing laminar free convection between vertical flat plates with asymmetric heating. J. Heat Transfer 98 (1976), 95–100.
76. Bar-Cohen, A., Rohsenow, W.M., Thermally optimum spacing of vertical natural convection cooled, parallel plates. J. Heat Transfer 106 (1984), 116–123.
77. Levy, E.K., Optimum plate spacings for laminar natural convection heat transfer from parallel vertical isothermal flat plates. J. Heat Transfer 93 (1971), 463–465.
78. Sparrow, E.M., Gregg, J.L., Similar solutions for free convection from a nonisothermal vertical plate. Trans. ASME 80 (1958), 379–386.
79. Churchill, S.W., Usagi, R., A general expression for the correlation of rates of transfer and other phenomena. AlChE J. 18 (1972), 1121–1138.
80. Moffat, R.J., Ortega, A., Direct air cooling of electronic components. Bar-Cohen, A., Kraus, A.D., (eds.) Advances in Thermal Modeling of Electronic Components and Systems, 1988, Hemisphere, Washington, D. C., 129–282.
81. Aihara, T., Natural convection heat transfer from vertical rectangular-fin arrays (Part 1–Heat Transfer from base plates of vertical open-channels. Rept. Inst. High Speed Mech., Tohoku Univ. 21 (1970), 105–134.
82. Aihara, T., Natural convection heat transfer from vertical rectangular-fin arrays (Part 2–Heat transfer from fin edges. Bull. JSME 113 (1970), 1182–1191.
83. Aihara, T., Natural convection heat transfer from vertical rectangular-fin arrays (Part 3–Heat transfer from fin flats. Bull. JSME 13 (1970), 1192–1200.
84. Aihara, T., Natural convection heat transfer from vertical rectangular-fin arrays (Part 4–Heat transfer characteristics of nonisothermal fin arrays. Bull. JSME 14 (1971), 818–828.
85. Fitzroy, N.D., Optimum spacing of fins cooled by free convection. J. Heat Transfer 93 (1971), 462–463.
86. Karki, K.C., Patankar, S.V., Cooling of a vertical shrouded fin array by natural convection: A numerical study. Fundamentals of Natural Convection/Electronic Equipment Cooling, 1984, ASME, New York, 33–40 ASME HTD-32.
87. Zhang, Z., Patankar, S.V., Influence of buoyancy on the vertical flow and heat transfer in a shrouded fin array. Int. J. Heat Mass Transfer 27 (1984), 137–140.
88. Carey, V.P., Mollendorf, J.C., The temperature field above a concentrated heat source on a vertical adiabatic surface. Int. J. Heat Mass Transfer 20 (1977), 1059–1067.
89. Goel, S., Jaluria, Y., Thermal transport from an isolated heat source on a vertical or inclined surface. Proc. Int. Heat Transfer Conf., 8th 3 (1986), 1341–1346.
90. Jaluria, Y., Interaction of natural convection wakes arising from thermal sources on a vertical surface. Fundamentals of Natural Convection/Electronic Equipment Cooling, 1984, ASME, New York, 67–76 ASME HTD-32.
91. Jaluria, Y., Buoyancy-induced flow due to isolated thermal sources on a vertical surface. J. Heat Transfer 104 (1982), 223–227.
92. Milanez, L.F., Bergles, A.E., Studies on natural convection heat transfer from thermal sources on a vertical surface. Proc. Int. Heat Transfer Conf., 8th 3 (1986), 1347–1352.
93. T. L. Ravine and D. E. Richards, Natural convection cooling of a finite-sized thermal source on the wall of a vertical channel. ASME Pap. No. 84-WA/HT-90(1984).
94. Pera, L., Gebhart, B., Laminar plume interactions. J. Fluid Mech. 68 (1975), 259–271.
95. Lieberman, J., Gebhart, E., Interactions in natural convection from an array of heated elements, experimental. Int. J. Heat Mass Transfer 12 (1969), 1385–1396.
96. Gebhart, B., Shaukatullah, H., Pera, L., Interaction of unequal laminar plane plumes. Int. J. Heat Mass Transfer 19 (1976), 751–756.
97. Jaluria, Y., Gebhart, B., Buoyancy induced flow arising from a line thermal source on an adiabatic vertical surface. Int. J. Heat Mass Transfer 20 (1977), 153–157.
98. Jaluria, Y., Natural convection due to line thermal sources on a vertical adiabatic surface. Proc. Int. Heat Transfer Conf., 7th 2 (1982), 147–152.
99. Park, K.A., Bergles, A.E., Natural convection heat transfer characteristics of simulated microelectronic chips. Heat Transfer in Electronic Equipment–1985, 1985, ASME, New York, 29–37 ASME HTD-48.
100. Shakerin, S., Bohn, M., Loehrke, R.I., Natural convection in an enclosure with discrete roughness elements on a vertical, heated wall. Proc. Int. Heat Transfer Conf., 8th, 1986, 1519–1525.
101. Anderson, R., Bohn, M., Heat transfer enhancement in natural convection enclosure flow. J. Heat Transfer 108 (1986), 330–336.
102. Sparrow, E.M., Cook, D.S., Chrysler, G.M., Heat transfer by natural convection from an array of short, wall-attached horizontal cylinders. J. Heat Transfer 104 (1982), 125–131.
103. Sparrow, E.M., Pfeil, D.R., Enhancement of natural convection heat transfer from a horizontal cylinder due to vertical shrouding surfaces. J. Heat Transfer 105 (1984), 124–130.
104. Sparrow, E.M., Chrysler, G.M., Natural convection heat transfer coefficients for a short horizontal cylinder attached to a vertical plate. J. Heat Transfer 103 (1981), 630–637.
105. Sparrow, E.M., Souza Mendes, P., Ansari, M.A., Prata, A.T., Duct-flow versus external flow natural convection at a short, wall-attached horizontal cylinder. Int. J. Heat Mass Transfer 26 (1983), 881–889.
106. Sparrow, E.M., Chrysler, G.M., Natural convection fluid flow patterns resulting from the interaction of a heated vertical plate and an attached horizontal cylinder. J. Heat Transfer 104 (1982), 798–800.
107. S. F. Horton, Natural convection from parallel plates with grooved surfaces. M. S. Thesis, Dep. Mech. Eng., Massachusetts Institute of Technology, Cambridge, 1981.
108. Campo, W.C., Kerjilian, G., Shaukatullah, H., Prediction of component temperatures on circuit cards cooled by natural convection. Proc. Electron. Components. Conf., 32nd, 1982, 150–152.
109. Ortega, A., Moffat, R.J., Heat transfer from an array of simulated electronic components: experimental results for free convection with and without a shrouding wall. Heat Transfer in Electronic Equipment–1985, 1985, ASME, New York, 5–15 ASME HTD-48.
110. Ortega, A., Moffat, R.J., Buoyancy-induced convection in a nonuniformly heated array of cubical elements on a vertical channel wall. Heat Transfer in Electronic Equipment–1986, 1986, ASME, New York, 123–134 ASME HTD-56.
111. Moffat, R.J., Ortega, A., Buoyancy-induced forced convection. Heat Transfer in Electronic Equipment–1986, 1986, ASME, New York, 135–144 ASME HTD-57.
112. Ortega, A., Moffat, R.J., Experiments on Buoyance-Induced Convection Heat Transfer From an Array of Cubical Elements on a Vertical Channel Wall, 1986, Thermosci. Div., Dep. Mech. Eng., Stanford Univ., Stanford, Calif. Rep. HMT-38.
113. Fujii, T., Fujii, M., Takenchi, M., Influence of various surface roughness in natural convection. Int. J. Heat Mass Transfer, 16, 1973, 629.
114. R. J. Joffre and R. F. Barron, Effects of roughness on free convection. ASME Pap. No. 67-WA/HT-38(1967).
115. Praslov, R.S., On the effects of surface roughness on natural convection heat transfer from horizontal cylinders to air. Inzh.-Fiz. Zh. 4 (1971), 601–617.
116. Ramakrishna, K., Seetharama, K.N., Sarma, P.K., Turbulent heat transfer by free convection from a rough surface. J. Heat Transfer 100 (1978), 727–728.
117. Sastry, C.V.N., Murthy, V., Narayana, P., Sarma, P.K., Effect of discrete wall roughness on free convective heat transfer from a vertical tube. Spalding, D.B., Afgan, N., (eds.) Heat Transfer and Turbulent Buoyant Convection, 2, 1976, McGraw-Hill, New York.
118. Kraus, A.D., Bar-Cohen, A., Thermal Analysis and Control of Electronic Equipment, 1983, McGraw-Hill, New York.
119. Baker, E., Liquid cooling of microelectronic devices by free and forced convection. Microelectron. Reliab. 11 (1972), 213–222.
120. Baker, E., Liquid immersion cooling of small electronic devices. Microelectron. Reliab. 12 (1973), 163–173.
121. Fujii, T., Fujii, M., The dependence of local Nusselt number on Prandtl number in the case of free convection along a vertical surface with uniform heat flux. Int. J. Heat Mass Transfer 19 (1976), 121–122.
122. Martynenko, O.G., Berezovsky, A.A., Sokovishin, Y.A., Laminar free convection from a vertical plate. Int. J. Heat Mass Transfer 27 (1984), 869–881.
123. A. Bar-Cohen, Constant heating transient natural convection in partially insulated vertical enclosures. ASME Pap. 77-HT-35(1977).
124. Buller, M.L., Duclos, T.G., Thermal characteristics of horizontally oriented electronic components in an enclosed environment. IEEE Trans. Components, Hybrids, Manuf. Technol. CHMT-5 (1982), 493–498.
125. Chu, H.H., Churchill, S.W., Patterson, C.V.S., The effect of heater size, location, aspect ratio and boundary conditions on two dimensional, laminar natural convection in rectangular channels. J. Heat Transfer 98 (1976), 194–201.
126. Flack, R.D., Turner, B.L., Heat transfer correlations for use in naturally cooled enclosures with high-power integrated circuits. IEEE Trans. Components, Hybrids, Manuf. Technol. CHMT-3 (1980), 449–452.
127. Johnson, A.E., Torok, D., Software for fluid flow and heat transfer analyses for electronic packaging. Comput. Mech. Eng., 1985, 41–46 July.
128. M. Keyhani, V. Prasad, and R. Cox, An experimental study of natural convection in a vertical cavity with discrete heat sources. ASME Pap. No. 87-HT-76(1987).
129. R. E. Knock, Flow visualization study of natural convection from a heated protrusion in a liquid filled rectangular enclosure. M. S. Thesis, Naval Postgraduate School, Monterey, California, 1983.
130. Krane, R.J., Phillips, T.J., Natural convection cooling of a horizontally-oriented component board mounted in a low-aspect ratio enclosure. Heat Transfer in Electronic Equipment–1986, 1986, ASME, New York, 113–122 ASME HTD-57.
131. Sparrow, E.M., Prakash, C., Interaction between internal natural convection in an enclosure and an external natural convection boundary-layer flow. Int. J. Heat Mass Transfer 24 (1981), 895–907.
132. Torok, D., Augmenting experimental studies for flow and thermal field prediction by the finite element method. Proc. Int. Comput. Eng. Conf. Exhibit 1 (1984), 509–517.
133. Turner, B.L., Flack, R.D., The experimental measurement of natural convective heat transfer in rectangular enclosures with concentrated energy sources. J. Heat Transfer 102 (1980), 236–241.
134. Steinberg, D.S., Cooling Techniques for Electronic Equipment, 1980, Wiley, New York.
135. Nakayama, W., Thermal management of electronic equipment: A review of technology and research topics. Appl. Mech. Rev. 39 (1986), 1847–1868.
136. Seely, J.H., Chu, R.C., Heat Transfer in Microelectronic Equipment, 1972, Dekker, New York.
137. Ellison, G.N., Thermal Computations for Electronic Equipment, 1984, Van Nostrand-Reinhold, New York.
138. Moffat, D.F., Ramadhyani, S., Incropera, F.P., Conjugate heat transfer from wall embedded sources in turbulent channel flow. Heat Transfer in Electronic Equipment–1986, 1986, ASME, New York, 177–182 ASME HTD-57.
139. Ramadhyani, S., Moffat, D.F., Incropera, F.P., Conjugate heat transfer from small isothermal heat sources embedded in a large substrate. Int. J. Heat Mass Transfer 28 (1985), 1945–1952.
140. Incropera, F.P., Kerby, J.S., Moffat, D.F., Ramadhyani, S., Convection heat transfer from discrete heat sources in a rectangular channel. Int. J. Heat Mass Transfer 29 (1986), 1051–1058.
141. K. R. Samant and T. W. Simon, Heat transfer from a small, high-heat flux patch to a subcooled turbulent flow. ASME Pap. No. 86-HT-22(1986).
142. Andreopoulos, J., The response of a turbulent boundary layer to a double step-change in a wall heat flux. J. Heat Transfer 105 (1983), 841–845.
143. Kennedy, K.J., Zebib, A., Combined free and forced convection between horizontal parallel planes: Some case studies. Int. J. Heat Mass Transfer 26 (1983), 471–474.
144. Davalath, J., Bayazitoglu, Y., Forced convection cooling across rectangular blocks. J. Heat Transfer 109 (1987), 321–328.
145. R. C. Schmidt and S. V. Patankar, A numerical study of laminar forced convection across heated rectangular blocks in two-dimensional ducts. ASME Pap. No. 86-WA/HT-88(1986).
146. Sparrow, E.M., Chukaev, A., Forced-convection heat transfer in a duct having spanwise periodic rectangular protuberances. Numer. Heat Transfer 3 (1980), 149–167.
147. G. L. Lehmann and R. A. Wirtz, Convection from surface mounted repeating ribs in a channel flow. ASME Pap. No. 84-WA/HT-88(1984).
148. Lehmann, G.L., Wirtz, R.A., The effect of variations in stream-wise spacing and length on convection from surface mounted rectangular components. Heat Transfer in Electronic Equipment–1985, 1985, ASME, New York, 39–47 ASME HTD-48.
149. D. E. Arvizu, Experimental heat transfer from an array of heated cubical elements on an adiabatic channel wall. Ph. D. Thesis, Thermosci. Div., Mech. Eng. Dep., Stanford University, Stanford, California, 1981. [Also available as Thermosci. Div. Rep. HMT-33.].
150. Patankar, S.V., Numerical Heat Transfer and Fluid Flow, 1980, McGraw-Hill, New York.
151. Patankar, S.V., A calculation procedure for two-dimensional elliptic situations. Numer. Heat Transfer 4 (1981), 409–425.
152. Ashiwake, N., Nakayama, W., Daikoku, T., Kobayashi, F., Forced convective heat transfer from LSI packages in an air-cooled wiring card array. Heat Transfer in Electronic Equipment–1983, 1983, ASME, New York, 35–42 ASME HTD-28.
153. Arvizu, D.E., Moffat, R.J., The use of superposition in calculating cooling requirements for circuit board mounted electronic components. Proc. Electron. Components Conf., 32nd, 1982, 133–144.
154. Y. Asako and M. Faghri, Three-dimensional heat transfer and fluid flow analysis of arrays of rectangular blocks encountered in electronic equipment. ASME Pap. No. 87-HT-73(1987).
155. C. A. Bibier and B. G. Sammakia, Transport from discrete heated components in a turbulent channel flow. ASME Pap. No. 86-WA/HT-68(1986).
156. Buller, M.L., Kilburn, R.F., Evaluation of surface heat transfer coefficients for electronic module packages. Heat Transfer in Electronic Equipment, 1981, ASME, New York, 25–28 ASME HTD-20.
157. M. J. Chang, R. J. Shyu, and L. J. Fang, An experimental study of heat transfer from surface mounted components to a channel airflow. ASME Pap. No. 87-HT-75(1987).
158. D. E. Metzger, R. A. Berry, and J. P. Bronson, Developing heat transfer in rectangular ducts with arrays of short pin fins. ASME Pap. No. 81-WA/HT-6(1981).
159. Moffat, R.J., Arvizu, D.E., Ortega, A., Cooling electronic components: forced convection experiments with an air-cooled array. Heat Transfer in Electronic Equipment–1985, 1985, ASME, New York, 17–27 ASME HTD-48.
160. J. D. Piatt, Heat transfer from an array of heated cylindrical elements on an adiabatic channel wall. M. S. Thesis, Naval Postgraduate School, Monterey, California, 1986.
161. Sparrow, E.M., Niethhammer, J.E., Chaboki, A., Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment. Int. J. Heat Mass Transfer 25 (1982), 961–973.
162. Sparrow, E.M., Otis, D.R. Jr., Ductflow heat transfer at a smooth wall which faces a wall covered by protuberances. Int. J. Heat Mass Transfer 28 (1985), 1317–1326.
163. Sparrow, E.M., Vemuri, S.B., Kadle, D.S., Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components. Int. J. Heat Mass Transfer 26 (1983), 689–699.
164. Sparrow, E.M., Yanezmoreno, A.A., Otis, D.R. Jr., Convective heat transfer response to height differences in an array of block-like electronic components. Int. J. Heat Mass Transfer 27 (1984), 469–473.
165. Wirtz, R.A., Dykshoorn, P., Heat transfer from arrays of flat packs in channel flow. Proc. Int. Electron. Packag. Soc. Conf., 4th, New York, 1984, 318–326.
166. Bullister, E.T., Karniadakis, G.E., Mikic, B.B., Patera, A.T., A spectral element method applied to the cooling of electronic components. Heat Transfer in Electronic Equipment–1986, 1986, ASME, New York, 153–159 ASME HTD-57.
167. Kays, W.M., Crawford, M.E., Convective Heat and Mass Transfer, 2nd Ed., 1980, McGraw-Hill, New York.
168. Afrid, M., Zebib, A., Natural convection air cooling of heated components mounted on a vertical wall. Temperature/Fluid Measurements in Electronic Equipment, 1987, ASME, New York, 17–24 ASME HTD-89.
169. Braaten, M.E., Patankar, S.V., Analysis of laminar mixed convection in shrouded arrays of heated rectangular blocks. Fundamentals of Natural Convection/ Electronic Equipment Cooling, 1984, ASME, New York, 77–84 ASME HTD-32.
170. Habchi, S., Acharya, S., Laminar mixed convection in a partially blocked vertical channel. Heat Transfer in Electronic Equipment–1986, 1986, ASME, New York, 189–197 ASME HTD-57.
171. Hwang, V.P., Effect of flow direction on mixed convection heat transfer from a vertical flat plate and a plate with square protuberances. Lett. Heat Mass Transfer 6 (1979), 459–468.
172. Tewari, S.S., Jaluria, Y., Goel, S., Natural and mixed convection transport from finite size heat sources on a flat plate in cooling of electronic equipment. Temperature/Fluid Measurements in Electronic Equipment, 1987, ASME, New York, 1–9 ASME HTD-89.
173. R. A. Wirtz and T. Hamadah, Mixed convection from simulated electronics packages. ASME Pap. No. 87-HT-74(1987).
174. Ghaddar, N.K., Korczak, K.Z., Mikic, B., Patera, A.T., Numerical investigation of incompressible flow in grooved channels: Stability and self-sustained oscillations. J. Fluid Mech. 163 (1986), 99–127.
175. Karniadakis, G., Mikic, B., Patera, A.T., Minimum dissipation transport enhancement by flow destabilization: Reynolds analogy revisited. J. Fluid Mech. 192 (1988), 365–391.
176. H. Kozlu, B. Mikic, and A. T. Patera, Minimum dissipation heat removal by scalematched flow destabilization. Int. J. Heat Mass Transfer (to be published).
177. Patera, A.T., Mikic, B.B., Exploiting hydrodynamic instabilities. Resonant heat transfer enhancement. Int. J. Heat Mass Transfer 29 (1986), 1127–1138.
178. Greene, A.O., Wightmann, J.C., Cooling Electronic Equipment by Direct Evaporation of Liquid Refrigerants, 1948, Wright-Patterson AFB, Fairborn, Ohio Air Mater. Command Rep. PB 136065.
179. London, A.L., Air coolers for high power vacuum tubes. Trans. IRE Prof. Group Electron. ED-1:2 (1954), 9–26.
180. Simons, R.E., Seely, J.H., A survey of vapor phase cooling systems. Electron. Des. 17 (1969), 53–56.
181. Powers, J.H., Better high-density circuit cooling through nucleate boiling. Electron. Packag. Prod., XXX, 1970.
182. Oktay, S., Multi-fluid subdued boiling: Theoretical analysis of multi-fluid interface bubbles. IBM J. Res. Dev. 15 (1971), 342–354.
183. Cochran, D.L., Boiling heat transfer in electronics. Electron. Packag. Prod. 8:7 (1968), 3–7.
184. Markowitz, A., Bergles, A.E., Operational limits of a submerged condenser. Prog. Heat Mass Transfer 6 (1972), 701–716.
185. Megerlin, F., Vingerhoet, P., Thermal control of densely packaged microelectronics in dielectric fluids. Proc. Nat. Aeronaut. Electron. Conf, 1971, 254–259.
186. Foti, J.J., Using liquids to cool microelectronics. IEEE Mil. Electron. Conf. Rec. MIL-E-CON 9 (1965), 1–4.
187. Bergles, A.E., Bakhru, N., Shires, J.W. Jr., Cooling of High-Power-Density Computer Components, 1968, MIT, Cambridge, Mass. Eng. Proj. Lab. Rep. 70712–60.
188. Rohsenow, W.M., Choi, H., Heat, Mass and Momentum Transfer, 1961, Prentice-Hall, Englewood Cliffs, New Jersey.
189. Murphy, R.W., Bergles, A.E., Subcooled flow boiling of fluorocarbons–hysteresis and dissolved gas effects. Proc. Heat Transfer Fluid Mech. Inst., Stanford Univ., 1972, 400–416.
190. Bar-Cohen, A., Simon, T.W., Wall superheat excursions in the boiling incipience of dielectric fluids. Bar-Cohen, A., (eds.) Heat Transfer in Electronic Equipment, 1986, ASME, New York, 83–94 ASME HTD-57.
191. Reeber, M.D., Frieser, R.G., Heat transfer of modified silicon surfaces. IEEE Trans. 3 (1980), 387–391.
192. Aakalu, N.G., Condensation heat transfer of dielectric vapor in presence of air. Oktay, S., Bar-Cohen, A., (eds.) Heat Transfer in Electronic Equipment, 1983, ASME, New York, 21–28 ASME HTD-28.
193. Gregor, L.C., Packaging semiconductors with liquids. Proc. Int. Microelectron. Conf., 1976, 37–42.
194. Oktay, S., Departure from natural convection (DNC) in low-temperature boiling heat transfer encountered in cooling microelectronic LSI devices. Proc. Int. Heat Transfer Conf., 7th 4 (1982), 113–118.
195. Hwang, U.P., Moran, K.P., Boiling heat transfer of silicon intergrated circuit chips mounted on a substrate. Kelleher, M., Yovanovich, M.M., (eds.) Heat Transfer in Electronic Equipment, 1981, ASME, New York, 53–59 ASME HTD-20.
196. Goldberg, N., Design of thin film multichip modules. Int. J. Hybrid Microelectron. 10 (1981), 289–295.
197. Fujii, M., Nishhiyama, E., Yamanaka, G., Nucleate pool boiling heat transfer from microporous heating surfaces. Chenoweth, J., et al. (eds.) Advances in Enhanced Heat Transfer, 1979, ASME, New York, 45–51.
198. Ciccio, J.A., Thun, R.E., Ultra-high density VLSI modules. IEEE Trans. 1 (1978), 242–248.
199. Block, R., Silverstein, M., Arnold, J.T., Bar-Cohen, A., Thermal management of VHSIC-based hardware. Proc. Annu. Conf. Int. Packag. Soc., 1st, 1981, 314–328.
200. Morrison, R.A., Improved avionics reliability through phase change conductive cooling. Proc. IEEE Natl. Telesyst. Conf., 1982, B5.6.1–B5.6.5.
201. Ma, C.F., Bergles, A.E., Boiling jet impingement cooling of simulated microelectronic chips. Oktay, S., Bar-Cohen, A., (eds.) Heat Transfer in Electronic Equipment, 1983, ASME, New York, 5–12 ASME HTD-28.
202. Vajravelu, K., Sastri, K.S., Fully developed laminar free convection flow between parallel vertical walls–I. Int. J. Heat Mass Transfer 20 (1977), 655–660.
203. Webb, R.L., The evolution of enhanced surface geometries for nucleate boiling. Heat Transfer Eng. 2:3–4 (1981), 46–69.
204. Bergles, A.E., Chyu, M.C., Characteristics of nucleate pool boiling from porous metallic coatings. Webb, R.L., et al. (eds.) Advances in Enhanced Heat Transfer, 1981, ASME, New York, 61–72 ASME HTD-18.
205. Nakayama, W., Darkoku, T., Nakajima, T., Effects of pore diameters and system pressure on nucleate boiling heat transfer from porous surfaces. Webb, R.L., et al. (eds.) Advances in Enhanced Heat Transfer, 1981, ASME, New York, 147–153.
206. Marto, P.J., Lepere, J., Pool boiling heat transfer from enhanced surfaces to dielectric fluids. Webb, R.L., et al. (eds.) Advances in Enhanced Heat Transfer, 1981, ASME, New York, 93–102 ASME HTD-18.
207. Park, K.A., Bergles, L.A., Effects of size of simulated microelectronic chips on boiling and critical heat flux. J. Heat Transfer, 110, 1988, 728.
208. Anderson, T.M., Mudawwar, I., Microelectronic cooling by enhanced pool boiling of a dielectric fluorocarbon liquid. Jacobs, H.R., (eds.) Proc. ASME Natl. Heat Transfer Conf., 1, 1988, 551–560.
209. Mudawwar, I.A., Incropera, T.A., Incropera, F.P., Microelectronic cooling by fluorocarbon liquid films. Aung, W., (eds.) Cooling Technology for Electronic Equipment, 1988, Hemisphere, Washington, D. C., 417–434.
210. Yao, S.C., Chang, Y., Pool boiling heat transfer in a confined space. Int. J. Heat Mass Transfer 26 (1983), 841–848.
211. Mohenski, T.A., Chen, S.C., Chatto, J.C., Microelectronic cooling by fluorocarbon liquid films. Aung, W., (eds.) Cooling Technology for Electronic Equipment, 1988, Hemisphere, Washington, D. C., 397–416.
212. Tong, L.S., Boiling Heat Transfer, 1965, Wiley, New York, 135.
213. Macbeth, R.V., The burn-out phenomenon in forced-convection boiling. Adv. Chem. Eng., 7, 1968, 207.
214. Gambill, W.R., Burnout in boiling heat transfer, part II: Subcooled forced-convection systems. Nucl. Saf., 9, 1968, 467.
215. Hewitt, G.F., Hall-Taylor, N.S., Annular Two-Phase Flow, 1970, Pergamon, Oxford, 219–252.
216. Bergles, A.E., Kakac, S., Veziroglu, T.N., (eds.) Burnout in boiling heat transfer, part II: Subcooled and low quality forced-convection systems, Two-Phase Flows and Heat Transfer, 2, 1976, Hemisphere, Washington, D. C., 693.
217. Butterworth, D., Hewitt, G.F., (eds.) Two-Phase and Heat Transfer, 1977, Oxford Univ. Press, London, 252–322.
218. Marinelli, V., Critical heat flux: A review of recent publications. Nucl. Technol., 34, 1977, 135.
219. Hewitt, G.F., Critical heat flux in flow boiling. Proc. Int. Heat Transfer Conf., 6th, 6, 1978, 143.
220. Theofanous, T.C., The boiling crisis in nuclear reactor safety and performance. Int. J. Multiphase Flow, 6, 1980, 69.
221. Collier, J.C., Convective Boiling and Condensation, 1981, McGraw-Hill, New York, 248–313.
222. Hewitt, G.F., Burnout. Hetsroni, G., (eds.) Handbook of Multiphase Systems, 1982, Hemisphere, Washington, D. C., 6.66.
223. Gambill, W.R., Burnout in boiling heat transfer, part I: Pool boiling systems. Nucl. Saf., 9, 1968, 351.
224. Bergles, A.E., Burnout in boiling heat transfer, part I: Pool boiling systems. Kakac, S., Veziroglu, T.N., (eds.) Two-Phase Flows and Heat Transfer, 2, 1976, Hemisphere, Washington, D. C., 671.
225. Efimov, V.A., Survey of experimental research on the mechanism of the heat transfer crisis during boiling. Heat Transfer–Sov. Res. 4 (1972), 27–38.
226. Bergles, A.E., Burnout in boiling heat transfer, part I: Pool boiling system. Nucl. Saf. 16 (1975), 28–42.
227. Kutateladze, S.S., Heat Transfer in Condensation and Boiling. AEC Rep., AEC-TR-3770, 1959.
228. Zuber, N., On the stability of boiling heat transfer. Trans. ASME 80 (1958), 711–720.
229. Zuber, N., Tribus, M., Westwater, J.W., The hydrodynamic crisis in pool boiling of saturated and subcooled liquids. Int. Dev. Heat Transfer, 1961, 230–236 Part II.
230. Lienhard, J.H., Dhir, V.K., Hydrodynamic prediction of peak pool boiling heat fluxes from finite bodies. J. Heat Transfer 95 (1973), 152–158.
231. Sun, K.H., Lienhard, J.H., The pool boiling heat flux on horizontal cylinders. Int. J. Heat Mass Transfer 13 (1970), 1425–1439.
232. J. H. Adams, A study of the critical heat flux in an accelerating pool boiling system. Ph. D. Thesis, University of Washington, Seattle, 1962.
233. Hwang, U.P., Moran, K.P., Boiling heat transfer of silicon integrated circuit chips mounted on a substrate. Kelleher, M.D., Yovanovich, M., (eds.) Heat Transfer in Electronic Equipment, 1981, ASME, New York, 53–59 ASME HTD-20.
234. Jiji, L.M., Dagan, Z., Experimental investigation of single phase multi-jet impingement cooling of an array of microelectronic heat sources. Aung, W., (eds.) Cooling Technology for Electronic Equipment, 1988, Hemisphere, Washington, D. C., 333–352.
235. Martin, H., Heat and mass transfer between impinging gas jets and solid surfaces. Adv. Heat Transfer 13 (1977), 1–60.
236. Olsson, R.G., Radial spread of a liquid stream on a horizontal plate. Nature (London, 211, 1966, 813.
237. Chaudhury, Z.H., Heat transfer in a radial liquid jet. J. Fluid Mech. 20 (1964), 501–511.
238. Nakatogawa, T., Nishiwaki, N., Hirata, M., Torii, K., Heat transfer of round turbulent jet impinging normally on flat plate. Proc. Int. Heat Transfer Conf., 4th, 2, 1970 Paper FC 6.1.
239. Katto, Y., Monde, M., Study of mechanism of burnout in a high heat flux boiling system with an impinging jet. Proc. Int. Heat Transfer Conf., 4th, 2, 1970 Paper FC 5.2.
240. Katto, Y., Ishii, K., Burnout in a high flux system with a forced supply of liquid through a plane jet. Proc. Int. Heat Transfer Conf., 6th 1 (1978), 435–440.
241. J. S. Goodling, R. C. Jaeger, and V. N. Williamson, Wafer scale cooling using jet impingement boiling heat transfer. ASME Pap. No. 87-WA/EEP-3(1987).
242. Ruch, M.A., Holman, J.P., Boiling heat transfer to a Freon-113 jet impinging upward onto a flat heated surface. Int. J. Heat Mass Transfer 18 (1975), 51–60.
243. Hrycak, P., Heat transfer from round impinging jets to a flat plate. Int. J. Heat Mass Transfer 26 (1983), 1857–1865.
244. R. K. Sakhuja, F. S. Lazgin, and M. J. Oven, Boiling heat transfer with arrays of impinging jets. ASME Pap. No. 80-HT-47(1980).
245. Yovanovich, M.M., Theory and applications of constriction and spreading resistance concepts for microelectronic thermal control. Proc. Int. Symp. Cool. Technol. Electron. Equip. Honolulu, Hawaii Keynote Address, 1987.
246. Cooper, M.G., Mickic, B.B., Yovanovich, M.M., Thermal contact conductance. Int. J. Heat Mass Transfer 12 (1969), 279–300.
247. Yeman, A.J., Burgess, J.F., Carlson, R.O., Neugbuer, C.A., Hot spots caused by voids and cracks in the chip mountdown medium in power semiconductor packaging. IEEE Trans. Components, Hybrids, Manuf. Technol. CHMT-6 (1983), 455–461.
248. Andrews, J.A., Mahalingham, L.M., Berg, H.M., Thermal characteristics of 16 and 40 pin plastic DIPs. IEEE Trans. Components, Hybrids, Manuf. Technol. CHMT-4 (1981), 455–461.
249. V.W. Antonetti M.M. Yovanovich Thermal contact resistance in microelectronic equipment “Thermal Management Concepts in Microelectronic Packaging,” 1984 ISHM Tech. Monogr. Ser. No. 6984–003 135 151.
250. Mahalingham, M., Nadhuker, M., Lofgran, L., Andrews, J., Olsen, D.R., Berg, H.M., Thermal effects of diebond voids in metal, ceramic and plastic packages. Semicond. Int., 1984, 71–79.
251. Peterson, G.P., Fletcher, L.S., Thermal contact resistance of silicon chip bonding materials. Aung, W., (eds.) Cooling Technology for Electronic Equipment, 1988, Hemisphere, Washington, D. C., 523–524.
252. M. M. Yovanovich, A. Hegazy, and V. W. Antonetti, Experimental verification of contact conductance models based upon distributed surface microhardness. AIAA Pap. No. 83–0532(1983).
253. V. W. Antonetti, On the use of metallic coatings to enhance thermal contact conductance. Ph. D. Thesis, University of Waterloo, Waterloo, Ontario, 1983.
254. A. A. Hegazy, Thermal joint conductance of conforming rough surfaces: Effects of surface microhardness variation. Ph. D. Thesis, University of Waterloo, Waterloo, Ontario, 1985.
255. Eid, J.C., Antonetti, V.W., Small scale thermal contact resistance of aluminum against silicon. Proc. Int. Heat Transfer Conf., 8th, 1986, 659–664.
256. Yovanovich, M.M., New contact and gap conductance correlations for conforming rough surfaces. AIAA Pap.(81–1164), 1981.
257. Peterson, G.P., Fletcher, L.S., Evaluation of heat transfer between mold compounds and heat spreader materials. ASME J. Heat Transfer 110 (1988), 996–999.
258. J. T. Pogson and J. L. Franklin, Analysis and temperature control of hybrid microcircuits. ASME Pap.73-ENAS-6(1973).
259. Buchanan, R.C., Reeber, M.D., Thermal considerations in the design of hybrid microelectronic packages. Solid State Technol. 16:2 (1973), 39–43.
260. Chu, R.C., Hwang, U.P., Simons, R.E., Conduction cooling for an LSI package: A one-dimensional approach. IBM J. Res. Dev. 26 (1982), 45–54.
261. Kharitonov, V.V., Kozhosev, L.S., Tyurin, Y.A., Effect of thermal conductivity of surface layers on contact thermal resistance. At Energ. 36 (1976), 308–310.
262. Hartop, R., Bathkev, D.A., A 400 kW long pulse V-band planetary radar. IEEE-MIT Microwave Symp. Dig. 4 (1976), 136–138.
263. B. Koh and J. E. John, The effect of foils on thermal contact resistance. ASME Pap. 65-HT-44(1965).
264. G. R. Cunnington, Thermal conductance of filled aluminum magnesium joints in a vacuum environment. ASME Pap. 64-WA/HT-40(1964).
265. Molgaard, J., Smeltzer, W.M., The thermal contact resistance at gold foil surfaces. Int. J. Heat Mass Transfer 13 (1970), 1153–1162.
266. Moore, J.P., Kollie, T.G., Graves, R.S., McElroy, C., Thermal conductivity measurements on solids between 20 and 150°C using a comparative longitudinal apparatus. Oak Ridge Natl. Lab. [Rep.] ORNL (U. S., ORNL-4121, 1967.
267. Mal'kov, V.A., Dobashin, P.A., The effect of soft-metal coatings and linings on contact thermal resistance. Inzh. -Fiz. Zh. 17 (1969), 871–879.
268. Yovanovich, M.M., Effect of foils upon joint resistance: Evidence of optimum thickness. AIAA Prog. Astronaut. and Aeronaut., Therm. Control Radiat. 31 (1973), 227–245.
269. Peterson, G.P., Fletcher, L.S., Thermal contact conductance in the presence of thin metallic foils. AIAA Pap.(88–0466), 1988.
270. Fletcher, L.S., The influence of interstitial media on spacecraft thermal control. Proc. Int. Symp. Space Technol. Sci., 14th, Tokyo, 1984, 527–532.
271. Fried, E., Kelly, M.J., Thermal conductance of metallic contacts in a vacuum. AIAA Pap.(65–661), 1965.
272. H. J. Shah, personal communication of unpublished data collected in (1979).
273. Antonetti, V.W., Yovanovich, M.M., Enhancement of thermal contact conductance by metallic coatings: Theory and experiment. ASME J. Heat Transfer 107 (1985), 513–519.
274. Al-Astrabadi, F.R., O'Callaghan, P.W., Probert, S.D., Thermal resistance of contacts: Influence of oxide films. AIAA Pap.(79–1065), 1979.
275. Negus, K.J., Yovanovich, M.M., Thompson, J.C., Thermal constriction resistance of circular contacts on coated surfaces: Effects of contact boundary conditions. AIAA Pap.(85–1014), 1985.
276. Song, S., Yovanovich, M.M., Explicit relative contact pressure expression: Dependence upon surface roughness parameters and Vickers microhardness coefficients. AIAA Pap.(AIAA-87–0152), 1987.
277. E. H. Gale, Jr., Effect of surface films on thermal contact conductance: Part 1–microscopic experiments. ASME Pap. 70-HT/SPT-26(1970).
278. Y. H. Tsao and R. W. Heimburg, Effects of surface films on thermal contact conductance: Part 2–macroscopic experiments. ASME Pap. 70-HT/SPT-27(1970).
279. R. S. Gaugler;, Heat transfer devices. U. S. Pat. No.(1944).
280. Grover, G.M., Cotter, T.P., Erikson, G.F., Structures of very high thermal conductivity. J. Appl. Phys. 218 (1964), 1190–1191.
281. Eastman, G.Y., The heat pipe. Sci. Am. 218:12 (1968), 38–46.
282. D. B. Tuckerman, Heat transfer microstructures for integrated circuits. Ph. D. Thesis, Stanford University, Stanford, California, 1981.
283. Ruttner, L.E., Application of heat pipes in the Navy's standard electronic module. Proc. Natl. Electron. Packag. Conf., 1978, 162–166.
284. Marto, P.J., Peterson, G.P., Application of heat pipes to electronics cooling. Bar-Cohen, A., Kraus, A.D., (eds.) Advances in Thermal Modeling of Electronic Components and Systems, 1988, Hemisphere, Washington, D. C., 283–336.
285. Peterson, G.P., Heat pipes in the thermal control of electronic components. Proc. Int. Heat Pipe Symp., 3rd, Tsukuba, Jpn., 1988, 2–12.
286. Chi, S.W., Heat Pipe Theory and Practice, 1976, McGraw-Hill, New York.
287. Eldridge, J.M., Peterson, K.E., Heat pipe vapor cooling etched silicon structure. IBM Tech. Discl. Bull. 25 (1983), 4118–4119.
288. D. A. Wolf, “Flexible Heat Pipe Switch,” Final Rep. NASA Contract No. NAS5–25568, Mod. 4(1981).
289. Miyazaki, Y., Sasaki, T., Thermal switch for space applications. Res. Dev. Heat Pipe Technol. 1 (1984), 445–450 JaTec, Tokyo.
290. Peterson, G.P., Analytical development and computer modeling of a bellows type heat pipe for the cooling of electronic components. Heat Transfer Eng. 9 (1988), 101–109.
291. Peterson, G.P., Analysis of a heat pipe thermal switch. Proc. Int. Heat Pipe. Conf., 6th, Grenoble, Fr. 1 (1987), 177–183.
292. B. R. Babin and G. P. Peterson, Modeling and testing of a flexible bellows heat pipe for cooling isolated heat sources. ASME Paper No. 89-HT-17(1989).
293. Murase, T., Yoshida, K., Fujikake, J., Koizumi, T., Ishida, N., Heat pipe heat sink HEAT KICKER for cooling of semi-conductors. Furukawa Rev. 2 (1982), 24–33.
294. Yoshida, K., Ogiwara, S., Murase, T., Ishida, S., Flat plate heat pipes for cooling devices. Res. Dev. Heat Pipe Technol. 1 (1984), 174–178 JaTec, Tokyo.
295. Murase, T., Endo, S., Koizumi, T., Heat pipe cooling system “POWERKICKER” for power semiconductor devices. Furukawa Rev. 4 (1986), 38–46.
296. Zorbil, V., Stulc, P., Heat pipes in computer modules. Res. Dev. Heat Pipe Technol. 1 (1984), 336–345 JaTec, Tokyo.
297. Zorbil, V., Stulc, P., Polasek, F., Enhancement cooling of the boards with integrated circuits by heat pipes. Proc. Int. Heat Pipe Symp., 3rd, Tsukuba, Jpn., 1988, 273–279.
298. Ptacnik, J., Polasek, F., Present state of heat pipe technology in the countries of mutual economic assistance. Proc. Int. Heat Pipe Symp., 3rd, Tsukuba, Jpn., 1988, 13–36.
299. Malik, P.R., Rao, K.S., Venkatesworly, P., Thermal response studies on heat pipes–thyristor assembly and its comparison with conventional cooling systems. Res. Dev. Heat Pipe Technol. 1 (1984), 352–357 JaTec, Tokyo.
300. Moran, K.P., Simons, R.E., Self-regulating evaporative/conductive thermal link. IBM Tech. Discl. Bull. 21 (1979), 3281–3282.
301. F. E. Andros and R. J. Shay, Micro-bellows thermo capsule. U. S. Pat. No. 4,212,349(1985).
302. Cotter, T.P., Principles and prospects of micro heat pipes. Res. Dev. Heat Pipe Technol. 1 (1984), 328–335 JaTec, Tokyo.
303. G. P. Peterson, “Investigation of Miniature Heat Pipes,” Final Rep. Wright Patterson Air Force Base, Contract No. F33615–86-C-2723, Task 9(1988).
304. Murase, T., Tanaka, S., Ishida, S., Natural convection type long heat pipe heat sink “POWERKICKER-N” for the cooling of GTO thyristor. Proc. Int. Heat Pipe Conf., 6th Grenoble, Fr., 1987, 537–542.
305. Kolb, H., Heat pipe cooling for thermoelectric generators. Proc. Int. Symp. Cool Technol. Electron. Equip., Honolulu, Hawaii, 1987, 161–172.
306. Aakalu, N.G., Carlen, R.A., Heat pipe links for water-cooled large computer circuit assemblies. IBM Tech. Discl. Bull. 27 (1984), 3551–3552.
307. Flat heat pipe assemblies keep PC boards cool. Mach. Des., 4, 1982, 272.
308. Adams, B.B., Kessler, S.W., Reed, R.E., Unique liquid cooled solid state power device development. Proc. IAS Conf., 14th, 1979, 141–148.
309. Token, K., Trends in aircraft thermal management. Proc. Printed Wiring Board Heat Pipe Workshop, 1986, Hughes Aircr. Co., Torrance, Calif.
310. Basiulis, A., Tanzer, H., McCabe, S., Heat pipes for cooling of high density printed wiring boards. Proc. Int. Heat Pipe Conf., 6th, Grenoble, Fr., 1987, 531–536.
311. Adami, M., Yimer, B., Development and evaluation of a planer heat pipe for cooling electronic systems. Proc. ASME Natl. Heat Transfer Conf., 1988, 499–507.
312. Ogushi, T., Murakami, M., Masumoto, H., Yoshida, H., Study on newly developed heat pipe heat sink. Proc. ASME Natl. Heat Transfer Conf., 1988, 517–522.
313. Bergles, A.E., Chu, R.C., Seely, J.H., Survey of heat transfer techniques applied to electronic packages. Natl. Electron. Packag. Prod. Conf., 1977, 370–385.
314. Dean, D.S., An integral heat pipe package for microelectronic circuits. Proc. Int. Heat Pipe Conf., 2nd, ESTEC, Noordwijk, Neth., 1976, 481–502.
315. Nelson, L.A., Sekhon, K.S., Fritz, J.E., Direct heat pipe cooling of semiconductor devices. Proc. Int. Heat Pipe Conf., 3rd AIAA, Washington, D. C., 1978, 373–376.
316. Nelson, L.A., Sekhon, K.S., Ruttner, L.E., Application of heat pipes in electronic modules. Proc. Int. Heat Pipe Conf., 3rd, AIAA, Washington, D. C., 1978, 367–372.
317. K. S. Sekhon, L. A. Nelson, and J. E. Fritz, Transistor cooling by heat pipes having a wick of dielectric powder. U. S. Pat. No. 4,047,198(1977).
318. Kromann, G.B., Hannermann, R.J., Fox, L.R., Two-phase internal cooling technique for electronic packages. Bar-Cohen, A., (eds.) Heat Transfer in Electronic Equipment, 1976, ASME, New York, 61–66 ASME HTD-57.
319. Wayner, P.C., Parks, C.J., Effect of liquid composition on enhanced flow due to surface shear in the contact line region: Constant vapor pressure boundary condition. Kirk, V.D., (eds.) Heat Transfer in Electronic Equipment, 1985, ASME, New York, 57–63 ASME HTD-47.
320. Kiewra, E.W., Wayner, P.C., A small scale thermosyphon for the immersion cooling of a disc heat source. Heat Transfer in Electronic Equipment, 1976, ASME, New York, 77–82 ASME HTD-47.
321. Johnson, R.D., Cooling of electrical and electronic equipment in sealed enclosures. Electron. Power 29 (1983), 332–336.
322. Shah, R.K., Giovannelli, A.D., Heat pipe heat exchanger design theory. Heat Transfer Equip. Des, 1987, Hemisphere, Washington, D. C.
323. Gerak, A., Horvath, L., Jelinek, F., Stulc, P., Zboril, V., Examples of heat pipe application in chemical, electrical and other industries. Proc. Int. Heat Pipe Conf., 6th Grenoble, Fr., 1987, 522–530.
324. Jakes, J., Vassicek, F., Polasek, F., Oslejsek, O., Cooling of air in cooled electrical machines by heat pipe heat exchangers. Proc. Int. Heat Pipe Symp., 3rd, Tsukuba, Jpn., 1988, 290–302.
325. Larkin, B.S., Temperature control of electronic systems using inexpensive heat pipes. Res. Dev. Heat Pipe Technol. 1 (1984), 346–351 JaTec, Tokyo.