Low-Temperature Wiring with Ag Nanoinks

IEEE Nanotechnology Magazine

Volumn 4, Issue 3, 2010, Pages 20-23

  Suganuma, Katsuaki ^a   Wakuda, Daisuke ^a   Hatamura, Mariko ^a   Nogi, Masaya ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

AU NANOPARTICLE; BULK STATE; CARBON MATERIAL; CERAMIC NANOMATERIALS; ELECTRIC RESISTIVITY; EXPERIMENTAL APPROACHES; FILM SUBSTRATES; HIGH VACUUM; INDIUM TIN OXIDE; LOW TEMPERATURES; MELTING TEMPERATURES; METALLIC INKS; METALLIC NANOMATERIALS; METALLIC NANOPARTICLES; METALLIC POWDER; NANO-MATERIALS; NANO-PACKAGING; NANOINKS; NEW MATERIAL; ORGANIC MATERIALS; PEDOT-PSS; PRINTED ELECTRONICS; PRINTING METHOD; ROOM TEMPERATURE; ULTRAFINE;

ELECTRIC CONDUCTIVITY; GOLD; INDIUM COMPOUNDS; INK; MELTING POINT; METAL MELTING; NANOPARTICLES; NANOSTRUCTURED MATERIALS; SILVER; SINTERING; TIN; TIN OXIDES; TITANIUM COMPOUNDS; X RAY DIFFRACTION;

INK JET PRINTING;

EID: 77956653197     PISSN: 19324510     EISSN: None     Source Type: Journal    
DOI: 10.1109/MNANO.2010.938016     Document Type: Article

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